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- W3024537025 abstract "Abstract Grinding as a pre-treatment method for HF-HNO3-H2O solution etching of diamond wire sawn (DWS) multi-crystalline (multi-Si) silicon wafers was proposed and researched. Significant improvement in morphological uniformity and decrease in light reflectivity of the wet acid etched surface textures were achieved with the pre-treatment. The photoelectric-conversion efficiency gain of solar cells fabricated with the pretreated DWS multi-Si wafers was 0.32%, compared to solar cells fabricated with the same batch of untreated wafers in an identical production line. The grinding pre-treatment was observed to restructure the superficial layer of DWS multi-Si wafers. The surface modification layer was believed to be more easily reacted with the wet acid etching solution, proving responsible for the improvement of photoelectric-conversion efficiency of solar cells. This method could provide a new research idea for the wet acid texturization of DWS multi-Si wafers." @default.
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- W3024537025 date "2020-10-01" @default.
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- W3024537025 title "Surface modification of diamond wire sawn multi-crystalline silicon wafers by grinding pre-treatment for wet acid texturization" @default.
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- W3024537025 doi "https://doi.org/10.1016/j.mssp.2020.105191" @default.
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