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- W3033179804 abstract "[email protected] nanoparticles were synthesized to act as a doping conductive filler for micron-sized Ag plates as conductive adhesive. Because of the defect for conductive channels of Ag plates-based conductive adhesive, it is highly desirable to remove the defect to improve the conductivity. The synthesized [email protected] nanoparticles, prepared via a wet-chemical method, were found to enhance the conductivity and tensile strength of a Ag plates-based conductive adhesive. The volume resistivity of a [email protected] nanoparticle doped Ag plate-based conductive adhesive can be reduced to 2.0 × 10−6 Ω m, and the tensile strength of the conductive adhesive can reach 16 MPa, revealing their great potential for practical application." @default.
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- W3033179804 date "2020-10-01" @default.
- W3033179804 modified "2023-10-18" @default.
- W3033179804 title "Cu@Ag nanoparticles doped micron-sized Ag plates for conductive adhesive with enhanced conductivity" @default.
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- W3033179804 doi "https://doi.org/10.1016/j.ijadhadh.2020.102657" @default.
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