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- W3035814441 abstract "This paper deals with contacting of the standard electrical SMD components on the textile substrates. SMD components are contacted and also encapsulated in one single step by a thermocompress method. SMD components are embedded and fixed in the cavities of the plastic housing made by 3D printer. This housing is subsequently melted by the standard thermo-transfer device, which is used in textile industry for pattern transfer. The electrically conductive track can be embroidered by a conductive hybrid thread directly on the textile or printed by conductive ink on the housing." @default.
- W3035814441 created "2020-06-25" @default.
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- W3035814441 date "2020-05-01" @default.
- W3035814441 modified "2023-09-23" @default.
- W3035814441 title "Contacting of SMD Components on the Textile Substrates" @default.
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- W3035814441 doi "https://doi.org/10.1109/isse49702.2020.9120911" @default.
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