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- W3036496222 abstract "The Cu-Al-O system is of considerable interest for electronic packaging, where thin copper wires are bonded to alumina substrates. In order to optimize the adhesion properties of Cu to alumina, it has been suggested that a ternary bonding environment is necessary at the interface. In comparison to a model oxide system such as NiO/alumina, where NiO is the only stable oxide of Ni and only one phase forms during the reaction, the situation is more complex in the Cu-Al-O system. First, two oxides of copper can form with CuO stable at room temperature and Cu2O stable above 1020°C in air. In addition, two copper aluminate reaction products (CuAl 2 O 4 and CuAlO 2 ) can form in the Cu-Al-O system. In a previous study it was found that both form during reactions in air at 1100°C, with the relative positions of each dependent on the crystallographic orientation of the alumina substrate." @default.
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- W3036496222 date "1993-08-01" @default.
- W3036496222 modified "2023-09-27" @default.
- W3036496222 title "Characterization of copper oxide deposited on α-Al2O3 by pulsed-laser ablation" @default.
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- W3036496222 doi "https://doi.org/10.1017/s0424820100151593" @default.
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