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- W3036707466 abstract "Titanium is commonly used as an underlayer to aluminum alloy metal lines in integrated circuit applications, primarily for reliability considerations. The Ti/Al bilayer scheme may exhibit improved electromigration resistance as a combined result of two factors. In the first case, should a void form in Al line, the Ti layer would be capable of carrying a part of the increased current load, effectively shunting the current around the void. The second effect that Ti has is the improvement of the (111) crystallographic texture when compared to Al deposited directly on SiO2 (1). However, the fact that Al and Ti react to form the high resistivity intermetallic TiAl3 at temperatures above 350° C, represents a potentially serious limitation to the practical use of this system. One solution is to alloy the aluminum with silicon, which is known to retard the rate of formation of TiAl3 (2). We propose two mechanisms for the decreased reaction rate involving the diffusion of the Si into the TiAl3 where it acts as a barrier to Al diffusion." @default.
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- W3036707466 date "1995-08-13" @default.
- W3036707466 modified "2023-09-24" @default.
- W3036707466 title "Observation of silicon redistribution during TiAl3 formation in aluminum alloy/titanium bilayers" @default.
- W3036707466 cites W2018756848 @default.
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- W3036707466 doi "https://doi.org/10.1017/s0424820100138567" @default.
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