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- W3036749969 abstract "Wafer level chip scale package (WLCSP) is a low cost and high performing packaging format suitable for radio frequency (RF) applications where minimized package size and parasitics are critical. But it raises challenges to reliability. This paper reports a reliability study of WLCSP using GLOBALFOUNDRIES’ 45RFSOI technology. Based on comprehensive testing and deep understanding of the failure mechanisms, design optimizations for chip, board and interconnect were implemented. WLCSP reliability was significantly enhanced." @default.
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- W3036749969 date "2020-04-01" @default.
- W3036749969 modified "2023-09-26" @default.
- W3036749969 title "Enhanced WLCSP Reliability for RF Applications" @default.
- W3036749969 cites W2153633039 @default.
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- W3036749969 doi "https://doi.org/10.1109/edtm47692.2020.9118036" @default.
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