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- W3036934296 abstract "Polishing and cross-sectioning of integrated circuits is standard practice in failure analysis. With most integrated circuit defects, all that is usually needed is mechanical polishing to the cross-sectioned plane of interest. The sample is then ready for examination in the scanning electron microscope (SEM). However, some defects are too small or too subtle to be seen without delineating them in some way. Chemical etching is useful in many situations but sometimes does not highlight the defect and may introduce artifacts. In this experiment, cross-sectioned chips were ion milled for a short period to highlight or uncover defects. After locating failing transistors, samples were cross-sectioned on diamond paper using the open block method (i.e., not encapsulated in epoxy). A special ion mill sample holder was designed to accommodate the polishing fixture. This holder is inserted into the ion mill. (This eliminates the need to transfer the chip from one fixture to another, avoiding damage or contamination.) Samples were milled in a Gatan ion mill for an initial period of two minutes at a 20 degree tilt. A current of ˙5 mA and voltage of 5 kV were used. Samples were positioned so that maximum milling occurred in the area of the failing transistors." @default.
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- W3036934296 date "1989-08-06" @default.
- W3036934296 modified "2023-09-27" @default.
- W3036934296 title "Use of ion milling to expose and highlight defects on cross-sectioned integrated circuits" @default.
- W3036934296 doi "https://doi.org/10.1017/s0424820100155578" @default.
- W3036934296 hasPublicationYear "1989" @default.
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