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• W3043608658 abstract "In the embedded systems industry today, skyrocketing design and manufacturing costs of Systems-on-Chip (SoCs) are key limiting factors for growth. Emerging 2.5D-based System-In-Package (SiP) architectures show potential to lower these costs by enabling the reuse of hard core units and providing higher manufacturing yields due to small chiplet sizes.In this paper, we present Neksus, a novel architecture designed to lower SiP manufacturing costs, support modular plug-and-play chiplet integration, and leverage the unique properties of interposers. Key to Neksus is a new dedicated interconnect chiplet that addresses the limitations of SiP packaging technology by leveraging direct communication over a mini-chain IP-connection topology. In addition to satisfying SiP technology constraints, because our mini-chain design provides high-bandwidth IP-to-IP communication, it is particularly well-suited for bandwidth-intensive mobile applications. Our evaluation shows Neksus provides up to 28% performance improvement and 31% energy savings over recent SiP architecture." @default.
• W3043608658 created "2020-07-23" @default.
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• W3043608658 date "2020-05-01" @default.
• W3043608658 modified "2023-10-16" @default.
• W3043608658 title "Neksus: An Interconnect for Heterogeneous System-In-Package Architectures" @default.
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• W3043608658 doi "https://doi.org/10.1109/ipdps47924.2020.00012" @default.
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