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- W3045748744 abstract "The composites with high thermal conductivity (TC) have attracted extensive attention in thermal management fields. Incorporating a three dimensional (3D) thermal transport framework in polymer is one of the most effective ways to improve the TC of composites. However, most micro-zone of those 3D thermal transport framework is filled with polymers with very low TC, leading to limited TC improvement of polymer composites. Herein we presented a novel 3D boron nitride (BN)/nickel foam (NF)/epoxy (EP) composite with high TC. Results indicated that as a good reinforced filler with high TC, BN was homogeneously dispersed in epoxy and fully filled into 3D NF micro-zone to get obvious TC increase of the BN/NF/EP composites. With the micro-zone enhancement strategy, the prepared BN/NF/EP-50 composite demonstrated excellent thermal conductive property. The obtained TC (5.14 W m−1 K−1) is approximately 24 and 5 times higher than that of epoxy and NF/EP composite, respectively. This research potentially provides a unique way to design and fabricate high TC 3D materials with the micro-zone enhancement strategy." @default.
- W3045748744 created "2020-08-03" @default.
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- W3045748744 date "2020-12-01" @default.
- W3045748744 modified "2023-09-30" @default.
- W3045748744 title "High thermal conductivity of epoxy composites via micro-zone enhanced 3D interconnected nickel skeleton" @default.
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- W3045748744 doi "https://doi.org/10.1016/j.ceramint.2020.07.245" @default.
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