Matches in SemOpenAlex for { <https://semopenalex.org/work/W3048141862> ?p ?o ?g. }
Showing items 1 to 83 of
83
with 100 items per page.
- W3048141862 abstract "High-density interconnections are highly required for 3D IC such as FPGA and image sensor applications. Fine-pitch interconnects using conventional solder microbumps are still required. To meet this requirements, low-height Cu/Sn microbumps are evaluated in this study. The thermal compression bonding with the low-height solder microbumps makes it challenging to fulfill high-viscous capillary underfill (CUF) into extremely small gaps between the chips stacked in layers. Here, we demonstrate to apply a 7-μm-thick non-conductive film (NCF) to flip-chip bonding with the low-height solder microbumps. Compared with a CUF, the electrical characterization such as electromigration (EM) and leakage current of microbump daisy chains with the ultra-thin NCF was investigated with temperature cycle test (TCT) and unbiased HAST." @default.
- W3048141862 created "2020-08-13" @default.
- W3048141862 creator A5006295728 @default.
- W3048141862 creator A5009154212 @default.
- W3048141862 creator A5027836208 @default.
- W3048141862 creator A5036200957 @default.
- W3048141862 creator A5041535044 @default.
- W3048141862 creator A5051569845 @default.
- W3048141862 creator A5053075425 @default.
- W3048141862 date "2020-06-01" @default.
- W3048141862 modified "2023-10-16" @default.
- W3048141862 title "7-μm-thick NCF technology with low-height solder microbump bonding for 3D integration" @default.
- W3048141862 cites W1981823766 @default.
- W3048141862 cites W2008613919 @default.
- W3048141862 cites W2063114735 @default.
- W3048141862 cites W2076968636 @default.
- W3048141862 cites W2151613126 @default.
- W3048141862 cites W2159032199 @default.
- W3048141862 cites W2529942914 @default.
- W3048141862 cites W2585597896 @default.
- W3048141862 cites W2971326897 @default.
- W3048141862 doi "https://doi.org/10.1109/ectc32862.2020.00230" @default.
- W3048141862 hasPublicationYear "2020" @default.
- W3048141862 type Work @default.
- W3048141862 sameAs 3048141862 @default.
- W3048141862 citedByCount "2" @default.
- W3048141862 countsByYear W30481418622021 @default.
- W3048141862 countsByYear W30481418622023 @default.
- W3048141862 crossrefType "proceedings-article" @default.
- W3048141862 hasAuthorship W3048141862A5006295728 @default.
- W3048141862 hasAuthorship W3048141862A5009154212 @default.
- W3048141862 hasAuthorship W3048141862A5027836208 @default.
- W3048141862 hasAuthorship W3048141862A5036200957 @default.
- W3048141862 hasAuthorship W3048141862A5041535044 @default.
- W3048141862 hasAuthorship W3048141862A5051569845 @default.
- W3048141862 hasAuthorship W3048141862A5053075425 @default.
- W3048141862 hasConcept C127413603 @default.
- W3048141862 hasConcept C138055206 @default.
- W3048141862 hasConcept C139719470 @default.
- W3048141862 hasConcept C159985019 @default.
- W3048141862 hasConcept C162324750 @default.
- W3048141862 hasConcept C192562407 @default.
- W3048141862 hasConcept C24326235 @default.
- W3048141862 hasConcept C2777042071 @default.
- W3048141862 hasConcept C2779227376 @default.
- W3048141862 hasConcept C49040817 @default.
- W3048141862 hasConcept C50296614 @default.
- W3048141862 hasConcept C530198007 @default.
- W3048141862 hasConcept C59088047 @default.
- W3048141862 hasConcept C68928338 @default.
- W3048141862 hasConcept C79072407 @default.
- W3048141862 hasConceptScore W3048141862C127413603 @default.
- W3048141862 hasConceptScore W3048141862C138055206 @default.
- W3048141862 hasConceptScore W3048141862C139719470 @default.
- W3048141862 hasConceptScore W3048141862C159985019 @default.
- W3048141862 hasConceptScore W3048141862C162324750 @default.
- W3048141862 hasConceptScore W3048141862C192562407 @default.
- W3048141862 hasConceptScore W3048141862C24326235 @default.
- W3048141862 hasConceptScore W3048141862C2777042071 @default.
- W3048141862 hasConceptScore W3048141862C2779227376 @default.
- W3048141862 hasConceptScore W3048141862C49040817 @default.
- W3048141862 hasConceptScore W3048141862C50296614 @default.
- W3048141862 hasConceptScore W3048141862C530198007 @default.
- W3048141862 hasConceptScore W3048141862C59088047 @default.
- W3048141862 hasConceptScore W3048141862C68928338 @default.
- W3048141862 hasConceptScore W3048141862C79072407 @default.
- W3048141862 hasLocation W30481418621 @default.
- W3048141862 hasOpenAccess W3048141862 @default.
- W3048141862 hasPrimaryLocation W30481418621 @default.
- W3048141862 hasRelatedWork W1971573654 @default.
- W3048141862 hasRelatedWork W2007536553 @default.
- W3048141862 hasRelatedWork W2018862639 @default.
- W3048141862 hasRelatedWork W2038441048 @default.
- W3048141862 hasRelatedWork W2046947255 @default.
- W3048141862 hasRelatedWork W2265021586 @default.
- W3048141862 hasRelatedWork W2272282985 @default.
- W3048141862 hasRelatedWork W2735500619 @default.
- W3048141862 hasRelatedWork W3048141862 @default.
- W3048141862 hasRelatedWork W1964109897 @default.
- W3048141862 isParatext "false" @default.
- W3048141862 isRetracted "false" @default.
- W3048141862 magId "3048141862" @default.
- W3048141862 workType "article" @default.