FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W3048175077> ?p ?o ?g. }

• W3048175077 abstract "Recently, 5G and AI are driving the electronic devices to require high-performance computing and high-speed transmission. To support emergence of high speed 5G smartphone in mobile sector, the number of components is trending significantly upward. Technical approach for modularization is becoming critical importance due to a space constraint in mobile device. This research presents a substrate structure and technical method that enables a double-side package structure as a way to improve density of the part. Double-side package enables module size reduction by mounting the device not only on the top side (component side) but also on the bottom side (solder side). In this study, it was to enable flip chip bonding device of more than 100μm thickness by forming an independent pattern in cavity and fine I/O formation less than 400μm by forming a via and pad through the cavity layer. In order to reduce the shrinkage stress generated during the formation of the dielectric layer of the cavity structure, fabrication conditions and material change experiments were conducted. As a result, the warpage of the fabricated substrate was improved, and the module size was reduced by 30% compared to the normal substrate by implementing the cavity structure. After package assembly using our substrates passed standard reliability test, including thermal cycle, un-bias HAST, drop test and accelerated life test." @default.
• W3048175077 created "2020-08-13" @default.
• W3048175077 creator A5007226887 @default.
• W3048175077 creator A5011387125 @default.
• W3048175077 creator A5022052138 @default.
• W3048175077 creator A5027923515 @default.
• W3048175077 creator A5048414435 @default.
• W3048175077 creator A5088375513 @default.
• W3048175077 date "2020-06-01" @default.
• W3048175077 modified "2023-09-26" @default.
• W3048175077 title "Study on Advanced Substrate for Double-side Package to Reduce Module Size" @default.
• W3048175077 cites W1125970284 @default.
• W3048175077 cites W1581745193 @default.
• W3048175077 cites W1986133709 @default.
• W3048175077 cites W2032281090 @default.
• W3048175077 cites W2787053407 @default.
• W3048175077 cites W2885076034 @default.
• W3048175077 cites W2970272838 @default.
• W3048175077 cites W2971350468 @default.
• W3048175077 doi "https://doi.org/10.1109/ectc32862.2020.00297" @default.
• W3048175077 hasPublicationYear "2020" @default.
• W3048175077 type Work @default.
• W3048175077 sameAs 3048175077 @default.
• W3048175077 citedByCount "1" @default.
• W3048175077 countsByYear W30481750772021 @default.
• W3048175077 crossrefType "proceedings-article" @default.
• W3048175077 hasAuthorship W3048175077A5007226887 @default.
• W3048175077 hasAuthorship W3048175077A5011387125 @default.
• W3048175077 hasAuthorship W3048175077A5022052138 @default.
• W3048175077 hasAuthorship W3048175077A5027923515 @default.
• W3048175077 hasAuthorship W3048175077A5048414435 @default.
• W3048175077 hasAuthorship W3048175077A5088375513 @default.
• W3048175077 hasConcept C111368507 @default.
• W3048175077 hasConcept C121332964 @default.
• W3048175077 hasConcept C126233035 @default.
• W3048175077 hasConcept C127313418 @default.
• W3048175077 hasConcept C127413603 @default.
• W3048175077 hasConcept C136525101 @default.
• W3048175077 hasConcept C142724271 @default.
• W3048175077 hasConcept C159985019 @default.
• W3048175077 hasConcept C160671074 @default.
• W3048175077 hasConcept C163258240 @default.
• W3048175077 hasConcept C165013422 @default.
• W3048175077 hasConcept C184788189 @default.
• W3048175077 hasConcept C186260285 @default.
• W3048175077 hasConcept C192562407 @default.
• W3048175077 hasConcept C204787440 @default.
• W3048175077 hasConcept C24326235 @default.
• W3048175077 hasConcept C2777289219 @default.
• W3048175077 hasConcept C2779227376 @default.
• W3048175077 hasConcept C43214815 @default.
• W3048175077 hasConcept C49040817 @default.
• W3048175077 hasConcept C50296614 @default.
• W3048175077 hasConcept C530198007 @default.
• W3048175077 hasConcept C62520636 @default.
• W3048175077 hasConcept C68928338 @default.
• W3048175077 hasConcept C71924100 @default.
• W3048175077 hasConcept C79072407 @default.
• W3048175077 hasConceptScore W3048175077C111368507 @default.
• W3048175077 hasConceptScore W3048175077C121332964 @default.
• W3048175077 hasConceptScore W3048175077C126233035 @default.
• W3048175077 hasConceptScore W3048175077C127313418 @default.
• W3048175077 hasConceptScore W3048175077C127413603 @default.
• W3048175077 hasConceptScore W3048175077C136525101 @default.
• W3048175077 hasConceptScore W3048175077C142724271 @default.
• W3048175077 hasConceptScore W3048175077C159985019 @default.
• W3048175077 hasConceptScore W3048175077C160671074 @default.
• W3048175077 hasConceptScore W3048175077C163258240 @default.
• W3048175077 hasConceptScore W3048175077C165013422 @default.
• W3048175077 hasConceptScore W3048175077C184788189 @default.
• W3048175077 hasConceptScore W3048175077C186260285 @default.
• W3048175077 hasConceptScore W3048175077C192562407 @default.
• W3048175077 hasConceptScore W3048175077C204787440 @default.
• W3048175077 hasConceptScore W3048175077C24326235 @default.
• W3048175077 hasConceptScore W3048175077C2777289219 @default.
• W3048175077 hasConceptScore W3048175077C2779227376 @default.
• W3048175077 hasConceptScore W3048175077C43214815 @default.
• W3048175077 hasConceptScore W3048175077C49040817 @default.
• W3048175077 hasConceptScore W3048175077C50296614 @default.
• W3048175077 hasConceptScore W3048175077C530198007 @default.
• W3048175077 hasConceptScore W3048175077C62520636 @default.
• W3048175077 hasConceptScore W3048175077C68928338 @default.
• W3048175077 hasConceptScore W3048175077C71924100 @default.
• W3048175077 hasConceptScore W3048175077C79072407 @default.
• W3048175077 hasLocation W30481750771 @default.
• W3048175077 hasOpenAccess W3048175077 @default.
• W3048175077 hasPrimaryLocation W30481750771 @default.
• W3048175077 hasRelatedWork W10289208 @default.
• W3048175077 hasRelatedWork W1127501 @default.
• W3048175077 hasRelatedWork W27108545 @default.
• W3048175077 hasRelatedWork W29687913 @default.
• W3048175077 hasRelatedWork W3444318 @default.
• W3048175077 hasRelatedWork W36768882 @default.
• W3048175077 hasRelatedWork W4912264 @default.
• W3048175077 hasRelatedWork W50872900 @default.
• W3048175077 hasRelatedWork W5524073 @default.
• W3048175077 hasRelatedWork W8364340 @default.
• W3048175077 isParatext "false" @default.
• W3048175077 isRetracted "false" @default.
• W3048175077 magId "3048175077" @default.

• next