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• W3048260048 abstract "Since its inception, the flip-chip bonding process has allowed for an ever-increasing density of interconnections in microelectronic packages. While traditional mass reflow (MR) soldering continues to be useful, alternative techniques such as thermal compression bonding (TCB) have evolved to support denser interconnection technologies. However, the TCB process requires relatively long cycle times and is sensitive to chip site warpage, as well as solder volume, bonding force or alignment variations. We report on this study a new solid-state thermocompression bonding process. It relies on temporary mechanical joints that are formed at the beginning of the packaging process, using pressure at a temperature below the solder melting point. The electrical interconnections are formed when the solder joints are completely remelted at the end of the packaging process, when the BGA solder balls are soldered to the substrate. We call this the Bond At The End (BATE) process. We have investigated the critical bonding parameters needed to achieve the initial temporary bond. The optimal bonding parameters were found to be 200°C in temperature, 0.25 N/bump in force, with a 4.5 s dwell time and 6 s total bonding duration. Applying an Ar/H2 plasma treatment before the assembly process also improved the bonding strength. A thorough investigation of the mechanical anchoring mechanism was carried out. Strong mechanical joining appears to be the result of the migration of interfacial grains boundaries and of the resulting interlocking of the solder bump surfaces. The quality of the final joints after BGA reflow was characterized with optical micrographs, x-ray imaging, and C-mode scanning acoustic microscopy. Under the optimal bonding conditions, we observed a high electrical yield and good reliability in thermal cycling, consistent with finite element modeling indicating a normal thermal stress in the final solder joints." @default.
• W3048260048 created "2020-08-13" @default.
• W3048260048 creator A5006629836 @default.
• W3048260048 creator A5037959422 @default.
• W3048260048 creator A5053836901 @default.
• W3048260048 creator A5055799451 @default.
• W3048260048 creator A5064354791 @default.
• W3048260048 creator A5079047022 @default.
• W3048260048 creator A5088530569 @default.
• W3048260048 date "2020-06-01" @default.
• W3048260048 modified "2023-09-27" @default.
• W3048260048 title "Bond At The End: A Comprehensive Study of a New High-Throughput Bonding Process" @default.
• W3048260048 cites W1510032800 @default.
• W3048260048 cites W2013289273 @default.
• W3048260048 cites W2013929975 @default.
• W3048260048 cites W2020060759 @default.
• W3048260048 cites W2073077792 @default.
• W3048260048 cites W2099987573 @default.
• W3048260048 cites W2112474110 @default.
• W3048260048 cites W2131597737 @default.
• W3048260048 cites W2144625723 @default.
• W3048260048 cites W2168198234 @default.
• W3048260048 cites W2507448183 @default.
• W3048260048 cites W2513613747 @default.
• W3048260048 cites W2542961598 @default.
• W3048260048 cites W2592941550 @default.
• W3048260048 cites W2907978925 @default.
• W3048260048 cites W2916430835 @default.
• W3048260048 cites W1499660152 @default.
• W3048260048 doi "https://doi.org/10.1109/ectc32862.2020.00043" @default.
• W3048260048 hasPublicationYear "2020" @default.
• W3048260048 type Work @default.
• W3048260048 sameAs 3048260048 @default.
• W3048260048 citedByCount "0" @default.
• W3048260048 crossrefType "proceedings-article" @default.
• W3048260048 hasAuthorship W3048260048A5006629836 @default.
• W3048260048 hasAuthorship W3048260048A5037959422 @default.
• W3048260048 hasAuthorship W3048260048A5053836901 @default.
• W3048260048 hasAuthorship W3048260048A5055799451 @default.
• W3048260048 hasAuthorship W3048260048A5064354791 @default.
• W3048260048 hasAuthorship W3048260048A5079047022 @default.
• W3048260048 hasAuthorship W3048260048A5088530569 @default.
• W3048260048 hasConcept C119599485 @default.
• W3048260048 hasConcept C123745756 @default.
• W3048260048 hasConcept C127413603 @default.
• W3048260048 hasConcept C140269135 @default.
• W3048260048 hasConcept C159985019 @default.
• W3048260048 hasConcept C165005293 @default.
• W3048260048 hasConcept C171250308 @default.
• W3048260048 hasConcept C186260285 @default.
• W3048260048 hasConcept C187937830 @default.
• W3048260048 hasConcept C192562407 @default.
• W3048260048 hasConcept C201414436 @default.
• W3048260048 hasConcept C201845621 @default.
• W3048260048 hasConcept C2778413121 @default.
• W3048260048 hasConcept C2778844933 @default.
• W3048260048 hasConcept C2779227376 @default.
• W3048260048 hasConcept C31258907 @default.
• W3048260048 hasConcept C41008148 @default.
• W3048260048 hasConcept C49040817 @default.
• W3048260048 hasConcept C50296614 @default.
• W3048260048 hasConcept C530198007 @default.
• W3048260048 hasConcept C68928338 @default.
• W3048260048 hasConcept C69567186 @default.
• W3048260048 hasConcept C78519656 @default.
• W3048260048 hasConcept C79072407 @default.
• W3048260048 hasConcept C94709252 @default.
• W3048260048 hasConceptScore W3048260048C119599485 @default.
• W3048260048 hasConceptScore W3048260048C123745756 @default.
• W3048260048 hasConceptScore W3048260048C127413603 @default.
• W3048260048 hasConceptScore W3048260048C140269135 @default.
• W3048260048 hasConceptScore W3048260048C159985019 @default.
• W3048260048 hasConceptScore W3048260048C165005293 @default.
• W3048260048 hasConceptScore W3048260048C171250308 @default.
• W3048260048 hasConceptScore W3048260048C186260285 @default.
• W3048260048 hasConceptScore W3048260048C187937830 @default.
• W3048260048 hasConceptScore W3048260048C192562407 @default.
• W3048260048 hasConceptScore W3048260048C201414436 @default.
• W3048260048 hasConceptScore W3048260048C201845621 @default.
• W3048260048 hasConceptScore W3048260048C2778413121 @default.
• W3048260048 hasConceptScore W3048260048C2778844933 @default.
• W3048260048 hasConceptScore W3048260048C2779227376 @default.
• W3048260048 hasConceptScore W3048260048C31258907 @default.
• W3048260048 hasConceptScore W3048260048C41008148 @default.
• W3048260048 hasConceptScore W3048260048C49040817 @default.
• W3048260048 hasConceptScore W3048260048C50296614 @default.
• W3048260048 hasConceptScore W3048260048C530198007 @default.
• W3048260048 hasConceptScore W3048260048C68928338 @default.
• W3048260048 hasConceptScore W3048260048C69567186 @default.
• W3048260048 hasConceptScore W3048260048C78519656 @default.
• W3048260048 hasConceptScore W3048260048C79072407 @default.
• W3048260048 hasConceptScore W3048260048C94709252 @default.
• W3048260048 hasLocation W30482600481 @default.
• W3048260048 hasOpenAccess W3048260048 @default.
• W3048260048 hasPrimaryLocation W30482600481 @default.
• W3048260048 hasRelatedWork W14698583 @default.
• W3048260048 hasRelatedWork W23301723 @default.
• W3048260048 hasRelatedWork W3444318 @default.
• W3048260048 hasRelatedWork W38374167 @default.
• W3048260048 hasRelatedWork W4694136 @default.

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