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• W3048340802 abstract "Recent advances in non-destructive evaluation (NDE) techniques have enhanced our understanding of failure mechanisms in power electronic systems. In this proceedings article, we demonstrate shear-force microscopy as a technique to map subsurface voids in an electronic Si die soldered to a thermal sink. The proposed technique utilizes two piezoelectric wafers (dither and receiver) fitted to a scanning probe to monitor structural health of a substrate. The dither imparts high-frequency ultrasonic waves to a thin film of dielectric layer above the electronic device while the receiver detects attenuated reflected waves from the semiconductor device. The depth of penetration of ultrasonic waves in the device is controlled by varying the actuation frequency and input voltage to the dither. Presence of localized damages within the device affect mechanical boundary conditions of the vibrating probe which consequently manifests as a change in slope of the shear-force approach curve over the device. A shear-force regulated constant distance point scan is performed over a 1 mm2 area of the electronic device, and the slope of the approach curve at each point is used as a metric to trace the contour of the void between the Si die and solder layer. The contour of the damage mapped using a grid scan bears close resemblance to that reproduced using a confocal scanning acoustic microscope. We expect that this technique can be scaled up to a NDE technique in which a spatially distributed array of piezoelectric actuation elements are kept in close proximity to the microelectronic device and separated by a dielectric gel. The shear force signature between the piezoelectric actuation elements and the surface can precisely detect structural problems during testing of accelerated aging and aggressive thermal cycling of power electronic devices." @default.
• W3048340802 created "2020-08-13" @default.
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• W3048340802 date "2020-06-01" @default.
• W3048340802 modified "2023-09-23" @default.
• W3048340802 title "Imaging sub-surface defects in power electronic modules using shear-force microscopy" @default.
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• W3048340802 doi "https://doi.org/10.1109/ectc32862.2020.00221" @default.
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