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- W3048994717 abstract "In this paper, we discussed a model analysis of micro-electromechanical system(MEMS) thermoelectric device simulated using finite element(FE) method by considering the geometrical aspect, such as the shape and leg length, the structure and technology, such as the applied temperature and material effect. Bismuth telluride (Bi <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sub> Te <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>3</sub> ) is used as the semiconductor in the simulation; copper (Cu) layer with 0.1 mm thickness is used for the electrical contact between the TE leg. Three geometries, quadrated, rectangular and round bars, of the thermocouple legs, are tested, demonstrating that they perform on the same terms. The optimal leg length is around 1.5 mm to 2.0 mm for optimal output voltage. Moreover, it is shown that the higher open-circuit voltage generated by higher hot side temperature with temperature difference maintained at 70°C. The copper contact resistance was also studied, and the open-circuit voltage was confirmed to decrease with increasing thickness of the copper layer. This analysis result should provide important parameters for the development of compact and straightforward MEMS thermoelectric design for improving the performance of the energy harvester system." @default.
- W3048994717 created "2020-08-21" @default.
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- W3048994717 date "2020-07-01" @default.
- W3048994717 modified "2023-09-23" @default.
- W3048994717 title "Model analysis on the geometrical and technological aspect of Bi2Te3 based MEMS thermoelectric" @default.
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- W3048994717 doi "https://doi.org/10.1109/icse49846.2020.9166901" @default.
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