Matches in SemOpenAlex for { <https://semopenalex.org/work/W3081676008> ?p ?o ?g. }
- W3081676008 abstract "Integrating two-dimensional (2D) materials into semiconductor manufacturing lines is essential to exploit their material properties in a wide range of application areas. However, current approaches are not compatible with high-volume manufacturing on wafer level. Here, we report a generic methodology for large-area integration of 2D materials by adhesive wafer bonding. Our approach avoids manual handling and uses equipment, processes, and materials that are readily available in large-scale semiconductor manufacturing lines. We demonstrate the transfer of CVD graphene from copper foils (100-mm diameter) and molybdenum disulfide (MoS2) from SiO2/Si chips (centimeter-sized) to silicon wafers (100-mm diameter). Furthermore, we stack graphene with CVD hexagonal boron nitride and MoS2 layers to heterostructures, and fabricate encapsulated field-effect graphene devices, with high carrier mobilities of up to [Formula: see text]. Thus, our approach is suited for backend of the line integration of 2D materials on top of integrated circuits, with potential to accelerate progress in electronics, photonics, and sensing." @default.
- W3081676008 created "2020-09-08" @default.
- W3081676008 creator A5002705704 @default.
- W3081676008 creator A5012882741 @default.
- W3081676008 creator A5017319114 @default.
- W3081676008 creator A5020944869 @default.
- W3081676008 creator A5021093269 @default.
- W3081676008 creator A5027030035 @default.
- W3081676008 creator A5032405269 @default.
- W3081676008 creator A5032499522 @default.
- W3081676008 creator A5039326045 @default.
- W3081676008 creator A5045933589 @default.
- W3081676008 creator A5048315691 @default.
- W3081676008 creator A5052947572 @default.
- W3081676008 creator A5058060903 @default.
- W3081676008 creator A5061066057 @default.
- W3081676008 creator A5065244047 @default.
- W3081676008 creator A5085711393 @default.
- W3081676008 date "2021-02-10" @default.
- W3081676008 modified "2023-10-16" @default.
- W3081676008 title "Large-area integration of two-dimensional materials and their heterostructures by wafer bonding" @default.
- W3081676008 cites W1717784222 @default.
- W3081676008 cites W1912205236 @default.
- W3081676008 cites W1967897514 @default.
- W3081676008 cites W1971868693 @default.
- W3081676008 cites W1972789552 @default.
- W3081676008 cites W1977042446 @default.
- W3081676008 cites W1978679821 @default.
- W3081676008 cites W1984147166 @default.
- W3081676008 cites W1992506968 @default.
- W3081676008 cites W1996143267 @default.
- W3081676008 cites W1997772602 @default.
- W3081676008 cites W2022120785 @default.
- W3081676008 cites W2023923307 @default.
- W3081676008 cites W2025015431 @default.
- W3081676008 cites W2031654810 @default.
- W3081676008 cites W2033580560 @default.
- W3081676008 cites W2037956657 @default.
- W3081676008 cites W2039817120 @default.
- W3081676008 cites W2043231889 @default.
- W3081676008 cites W2043752657 @default.
- W3081676008 cites W2048610167 @default.
- W3081676008 cites W2049168656 @default.
- W3081676008 cites W2051901075 @default.
- W3081676008 cites W2065094140 @default.
- W3081676008 cites W2077263179 @default.
- W3081676008 cites W2078845291 @default.
- W3081676008 cites W2080432958 @default.
- W3081676008 cites W2084679444 @default.
- W3081676008 cites W2087863452 @default.
- W3081676008 cites W2091524530 @default.
- W3081676008 cites W2092044679 @default.
- W3081676008 cites W2092188263 @default.
- W3081676008 cites W2094088707 @default.
- W3081676008 cites W2099779584 @default.
- W3081676008 cites W2104839057 @default.
- W3081676008 cites W2107857539 @default.
- W3081676008 cites W2119517154 @default.
- W3081676008 cites W2131674279 @default.
- W3081676008 cites W2139511987 @default.
- W3081676008 cites W2148144129 @default.
- W3081676008 cites W2161115346 @default.
- W3081676008 cites W2175535179 @default.
- W3081676008 cites W2179508392 @default.
- W3081676008 cites W2312640850 @default.
- W3081676008 cites W2313963552 @default.
- W3081676008 cites W2315154079 @default.
- W3081676008 cites W2321494603 @default.
- W3081676008 cites W2323129131 @default.
- W3081676008 cites W2335370736 @default.
- W3081676008 cites W2411222128 @default.
- W3081676008 cites W2482878191 @default.
- W3081676008 cites W2528423716 @default.
- W3081676008 cites W2573049906 @default.
- W3081676008 cites W2584042866 @default.
- W3081676008 cites W2617448643 @default.
- W3081676008 cites W2625714282 @default.
- W3081676008 cites W2752701243 @default.
- W3081676008 cites W2754185939 @default.
- W3081676008 cites W2781638764 @default.
- W3081676008 cites W2784593261 @default.
- W3081676008 cites W2787584289 @default.
- W3081676008 cites W2790565236 @default.
- W3081676008 cites W2791989211 @default.
- W3081676008 cites W2792134346 @default.
- W3081676008 cites W2793369479 @default.
- W3081676008 cites W2802057809 @default.
- W3081676008 cites W2805518021 @default.
- W3081676008 cites W2903343625 @default.
- W3081676008 cites W2915950764 @default.
- W3081676008 cites W2920085947 @default.
- W3081676008 cites W2945964651 @default.
- W3081676008 cites W2948008280 @default.
- W3081676008 cites W2965684512 @default.
- W3081676008 cites W2971651165 @default.
- W3081676008 cites W2972241500 @default.
- W3081676008 cites W2972273952 @default.
- W3081676008 cites W2975458838 @default.
- W3081676008 cites W3009864654 @default.
- W3081676008 cites W3012642646 @default.