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• W3082593287 endingPage "106096" @default.
• W3082593287 startingPage "106096" @default.
• W3082593287 abstract "Nonmetals from the waste printed circuit board (NPCB) is the byproduct of waste printed circuit board recycling industry. The recycling of tons of NPCB for a clean environment and value-added product is still a great challenge. In this work, the possibility and feasibility of using NPCB to fabrication value-added thermal management materials are evaluated for the first time. The mechanical properties, thermal conductivity, dielectric performance and heavy metal leachate were studied. Due to the high aspect ratio of NPCB, the maximum tensile strength of LDPE/GNP/NPCB composites are increased from 24.9 MPa to 36.2 MPa and storage modulus maintained at 1403 MPa in 100 °C. Such data is much higher than those reported in the literature for LDPE/GNP composites and shows great potential for thermal management products. When increased NPCB content to 50 wt%, finite element simulation indicated that graphite nanosheets (GNP) interconnect and more heat flux is propagated through thermal conductive filler. The maximum thermal conductivity of LDPE/GNP/NPCB composites is increased from 1.0 W/mK to 1.6 W/mK. Moreover, the electrical conductivity of all samples is above 109 Ω cm, and the composites show low dielectric permittivity and dielectric loss, meeting the requirements of insulating and thermally conductive materials. The heavy metal leaching results show that after 20 days, the concentrations of Cu, Zn, Pb, Ba, Cr, and Ni ion are far below the regulatory limits. This work not only provides a promising strategy to resolve NPCB environment pollution but also value-added products in thermal management applications." @default.
• W3082593287 created "2020-09-08" @default.
• W3082593287 creator A5015195367 @default.
• W3082593287 creator A5030507080 @default.
• W3082593287 creator A5063561156 @default.
• W3082593287 date "2020-12-01" @default.
• W3082593287 modified "2023-09-27" @default.
• W3082593287 title "The novel application of nonmetals from waste printed circuit board in high-performance thermal management materials" @default.
• W3082593287 cites W1577623176 @default.
• W3082593287 cites W1939937364 @default.
• W3082593287 cites W1974892353 @default.
• W3082593287 cites W1995627806 @default.
• W3082593287 cites W2005921477 @default.
• W3082593287 cites W2015296704 @default.
• W3082593287 cites W2021833527 @default.
• W3082593287 cites W2047904968 @default.
• W3082593287 cites W2060165560 @default.
• W3082593287 cites W2068542474 @default.
• W3082593287 cites W2075703215 @default.
• W3082593287 cites W2081426599 @default.
• W3082593287 cites W2088104559 @default.
• W3082593287 cites W2095195305 @default.
• W3082593287 cites W2120354408 @default.
• W3082593287 cites W2132465685 @default.
• W3082593287 cites W2167589236 @default.
• W3082593287 cites W2175051006 @default.
• W3082593287 cites W2310230662 @default.
• W3082593287 cites W2319159108 @default.
• W3082593287 cites W2344963558 @default.
• W3082593287 cites W2345744526 @default.
• W3082593287 cites W2404380678 @default.
• W3082593287 cites W2492757284 @default.
• W3082593287 cites W2550165568 @default.
• W3082593287 cites W2561830417 @default.
• W3082593287 cites W2566998631 @default.
• W3082593287 cites W2605792304 @default.
• W3082593287 cites W2730219519 @default.
• W3082593287 cites W2767989338 @default.
• W3082593287 cites W2780561215 @default.
• W3082593287 cites W2784487991 @default.
• W3082593287 cites W2791192341 @default.
• W3082593287 cites W2890610609 @default.
• W3082593287 cites W2893957353 @default.
• W3082593287 cites W2896608643 @default.
• W3082593287 cites W2911232346 @default.
• W3082593287 cites W2925780806 @default.
• W3082593287 cites W2941285595 @default.
• W3082593287 cites W2958533591 @default.
• W3082593287 cites W2964699299 @default.
• W3082593287 cites W2974962110 @default.
• W3082593287 cites W2981619649 @default.
• W3082593287 cites W2995861930 @default.
• W3082593287 cites W3010487675 @default.
• W3082593287 cites W3026792020 @default.
• W3082593287 cites W3027300389 @default.
• W3082593287 cites W758118296 @default.
• W3082593287 doi "https://doi.org/10.1016/j.compositesa.2020.106096" @default.
• W3082593287 hasPublicationYear "2020" @default.
• W3082593287 type Work @default.
• W3082593287 sameAs 3082593287 @default.
• W3082593287 citedByCount "8" @default.
• W3082593287 countsByYear W30825932872021 @default.
• W3082593287 countsByYear W30825932872022 @default.
• W3082593287 countsByYear W30825932872023 @default.
• W3082593287 crossrefType "journal-article" @default.
• W3082593287 hasAuthorship W3082593287A5015195367 @default.
• W3082593287 hasAuthorship W3082593287A5030507080 @default.
• W3082593287 hasAuthorship W3082593287A5063561156 @default.
• W3082593287 hasConcept C108458091 @default.
• W3082593287 hasConcept C112950240 @default.
• W3082593287 hasConcept C119599485 @default.
• W3082593287 hasConcept C120793396 @default.
• W3082593287 hasConcept C127413603 @default.
• W3082593287 hasConcept C133386390 @default.
• W3082593287 hasConcept C159985019 @default.
• W3082593287 hasConcept C192562407 @default.
• W3082593287 hasConcept C2779751980 @default.
• W3082593287 hasConcept C49040817 @default.
• W3082593287 hasConcept C97346530 @default.
• W3082593287 hasConceptScore W3082593287C108458091 @default.
• W3082593287 hasConceptScore W3082593287C112950240 @default.
• W3082593287 hasConceptScore W3082593287C119599485 @default.
• W3082593287 hasConceptScore W3082593287C120793396 @default.
• W3082593287 hasConceptScore W3082593287C127413603 @default.
• W3082593287 hasConceptScore W3082593287C133386390 @default.
• W3082593287 hasConceptScore W3082593287C159985019 @default.
• W3082593287 hasConceptScore W3082593287C192562407 @default.
• W3082593287 hasConceptScore W3082593287C2779751980 @default.
• W3082593287 hasConceptScore W3082593287C49040817 @default.
• W3082593287 hasConceptScore W3082593287C97346530 @default.
• W3082593287 hasLocation W30825932871 @default.
• W3082593287 hasOpenAccess W3082593287 @default.
• W3082593287 hasPrimaryLocation W30825932871 @default.
• W3082593287 hasRelatedWork W1994753809 @default.
• W3082593287 hasRelatedWork W2043673973 @default.
• W3082593287 hasRelatedWork W2089085266 @default.
• W3082593287 hasRelatedWork W2105765014 @default.
• W3082593287 hasRelatedWork W2380293314 @default.

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