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• W3087600293 endingPage "107898" @default.
• W3087600293 startingPage "107898" @default.
• W3087600293 abstract "In this work, the use of sublimated copper phthalocyanine (CuPc) organic thin films as a buffer interlayer in aluminum tracks on paper is presented for the first time. The CuPc was synthetized using a new eco-friendly synthetic protocol and the higher purity of the product turn out to be useful for the set forth applications. With the use of the CuPc buffer interlayer it is possible to enable paper substrates as printed circuit boards and as dielectric material for flexible electronic devices. The connectivity of the aluminum tracks was evaluated when the paper substrate is bent several times and after ten months of storage at ambient conditions. In addition, the aluminum tracks exhibit reliable current driving capabilities to turn-on a LED device. Finally, the fabrication of a hybrid touch sensor on paper is demonstrated." @default.
• W3087600293 created "2020-09-25" @default.
• W3087600293 creator A5018219480 @default.
• W3087600293 creator A5041821678 @default.
• W3087600293 date "2020-10-01" @default.
• W3087600293 modified "2023-10-17" @default.
• W3087600293 title "Copper phthalocyanine buffer interlayer film incorporated in paper substrates for printed circuit boards and dielectric applications in flexible electronics" @default.
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• W3087600293 doi "https://doi.org/10.1016/j.sse.2020.107898" @default.
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