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• W3088392493 startingPage "1439" @default.
• W3088392493 abstract "The wafer-level integration of high aspect ratio silicon nanostructures is an essential part of the fabrication of nanodevices. Metal-assisted chemical etching (MACE) is a promising low-cost and high-volume technique for the generation of vertically aligned silicon nanowires. Noble metal nanoparticles were used to locally etch the silicon substrate. This work demonstrates a bottom-up self-assembly approach for noble metal nanoparticle formation and the subsequent silicon wet etching. The macroscopic wafer patterning has been done by using a poly(methyl methacrylate) masking layer. Different metals (Au, Pt, Pd, Cu, and Ir) were investigated to derive a set of technologies as platform for specific applications. Especially, the shape of the 3D structures and the resulting reflectance have been investigated. The Si nanostructures fabricated using Au nanoparticles show a perfect light absorption with a reflectance below 0.3%. The demonstrated technology can be integrated into common fabrication processes for microelectromechanical systems." @default.
• W3088392493 created "2020-10-01" @default.
• W3088392493 creator A5040306739 @default.
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• W3088392493 date "2020-09-23" @default.
• W3088392493 modified "2023-09-25" @default.
• W3088392493 title "Wafer-level integration of self-aligned high aspect ratio silicon 3D structures using the MACE method with Au, Pd, Pt, Cu, and Ir" @default.
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• W3088392493 doi "https://doi.org/10.3762/bjnano.11.128" @default.
• W3088392493 hasPubMedCentralId "https://www.ncbi.nlm.nih.gov/pmc/articles/7522463" @default.
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• W3088392493 hasPublicationYear "2020" @default.
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