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- W3088456438 abstract "In recent years, polymer-based packaging materials such as epoxy resin, silicone, phenolic resin, etc. have been widely used in electronic components such as integrated circuits, liquid crystal displays, LEDs, etc. due to their good insulation, simple molding, low density, and low cost. However, the corrosion failure of electronic components caused by polymer-based packaging materials is endless, and most of the reasons are due to the defects in the selection, synthesis and curing of polymer-based packaging materials. In order to prevent the corrosion and improve the reliability of electronic products, it is particularly important to identify the corrosion risk of polymer-based packaging materials. This paper analyzes the corrosion failure mechanism of electronic components through actual failure cases, and summarizes the effects of organic packaging material defects on the corrosion resistance of electronic components." @default.
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- W3088456438 date "2020-08-01" @default.
- W3088456438 modified "2023-09-23" @default.
- W3088456438 title "The Effects of Polymer-Based Packaging Materials Defects on the Corrosion Resistance of Electronic Components" @default.
- W3088456438 cites W1989757480 @default.
- W3088456438 doi "https://doi.org/10.1109/icept50128.2020.9202990" @default.
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