Matches in SemOpenAlex for { <https://semopenalex.org/work/W3089628143> ?p ?o ?g. }
Showing items 1 to 68 of
68
with 100 items per page.
- W3089628143 endingPage "13" @default.
- W3089628143 startingPage "7" @default.
- W3089628143 abstract "Conformal coating is commonly used for harsh environment to protect electronics from moisture and chemical contaminants. But the stresses imparted by the conformal coating can cause degradation to the package thermal cycle performance. Full coverage of the component with conformal coating material can prevent potential corrosion induced degradation but imply a local compression stress during thermal cycling, resulting a different thermal cycling performance compared to non-coated components. In this study, 8x8mm2 wafer level chip scale packages (WLCSP) were subjected to 5% NaCl aqueous spray test with and without full conformal coating, then thermal cycled from -40ºC to +125ºC. Weibull reliability statistics indicated that fully conformal coated components experience characteristic life cycle number reduction from 404 cycles to 307 cycles, a 24% lifetime reduction, comparing to no conformal coated, no salt spray test applied components. The correlation between crack propagation and localized recrystallization were compared in a series of cross section analyses using polarized imaging and electro-backscattered diffraction, which revealed that the conformal coating induced a z-axis tension and compression strain during thermal cycling, resulting in an accelerated degradation at the solder interconnect. Linear Laser profilometer measurements showed that fully conformal coated samples experienced a higher z-axis height displacement change relative to non-conformal coated samples when exposed to 125 °C with 10 minutes dwell. To prevent this z-axis strain a reworkable edgebond adhesive was applied with full conformal coating configuration, which demonstrate an increase of characteristic lifecycle number to 2783 cycles, suggesting that the mitigation of the z-axis strain can vastly enhance the thermal cycling performance." @default.
- W3089628143 created "2020-10-08" @default.
- W3089628143 creator A5008105806 @default.
- W3089628143 creator A5052592970 @default.
- W3089628143 creator A5052738372 @default.
- W3089628143 creator A5054060738 @default.
- W3089628143 creator A5062396307 @default.
- W3089628143 date "2020-10-02" @default.
- W3089628143 modified "2023-09-26" @default.
- W3089628143 title "Impact of Conformal Coating Induced Stress on Wafer Level Chip Scale Package Thermal Cycling Performance" @default.
- W3089628143 doi "https://doi.org/10.37665/smt.v33i2.8" @default.
- W3089628143 hasPublicationYear "2020" @default.
- W3089628143 type Work @default.
- W3089628143 sameAs 3089628143 @default.
- W3089628143 citedByCount "2" @default.
- W3089628143 countsByYear W30896281432021 @default.
- W3089628143 countsByYear W30896281432023 @default.
- W3089628143 crossrefType "journal-article" @default.
- W3089628143 hasAuthorship W3089628143A5008105806 @default.
- W3089628143 hasAuthorship W3089628143A5052592970 @default.
- W3089628143 hasAuthorship W3089628143A5052738372 @default.
- W3089628143 hasAuthorship W3089628143A5054060738 @default.
- W3089628143 hasAuthorship W3089628143A5062396307 @default.
- W3089628143 hasConcept C121332964 @default.
- W3089628143 hasConcept C159985019 @default.
- W3089628143 hasConcept C177564732 @default.
- W3089628143 hasConcept C192562407 @default.
- W3089628143 hasConcept C204530211 @default.
- W3089628143 hasConcept C2524010 @default.
- W3089628143 hasConcept C2777421745 @default.
- W3089628143 hasConcept C2781448156 @default.
- W3089628143 hasConcept C33923547 @default.
- W3089628143 hasConcept C47463417 @default.
- W3089628143 hasConcept C97355855 @default.
- W3089628143 hasConcept C98214594 @default.
- W3089628143 hasConceptScore W3089628143C121332964 @default.
- W3089628143 hasConceptScore W3089628143C159985019 @default.
- W3089628143 hasConceptScore W3089628143C177564732 @default.
- W3089628143 hasConceptScore W3089628143C192562407 @default.
- W3089628143 hasConceptScore W3089628143C204530211 @default.
- W3089628143 hasConceptScore W3089628143C2524010 @default.
- W3089628143 hasConceptScore W3089628143C2777421745 @default.
- W3089628143 hasConceptScore W3089628143C2781448156 @default.
- W3089628143 hasConceptScore W3089628143C33923547 @default.
- W3089628143 hasConceptScore W3089628143C47463417 @default.
- W3089628143 hasConceptScore W3089628143C97355855 @default.
- W3089628143 hasConceptScore W3089628143C98214594 @default.
- W3089628143 hasIssue "2" @default.
- W3089628143 hasLocation W30896281431 @default.
- W3089628143 hasOpenAccess W3089628143 @default.
- W3089628143 hasPrimaryLocation W30896281431 @default.
- W3089628143 hasRelatedWork W20831721 @default.
- W3089628143 hasRelatedWork W22125143 @default.
- W3089628143 hasRelatedWork W26821020 @default.
- W3089628143 hasRelatedWork W32249218 @default.
- W3089628143 hasRelatedWork W37861293 @default.
- W3089628143 hasRelatedWork W38374167 @default.
- W3089628143 hasRelatedWork W46637639 @default.
- W3089628143 hasRelatedWork W47102079 @default.
- W3089628143 hasRelatedWork W55899823 @default.
- W3089628143 hasRelatedWork W8498453 @default.
- W3089628143 hasVolume "33" @default.
- W3089628143 isParatext "false" @default.
- W3089628143 isRetracted "false" @default.
- W3089628143 magId "3089628143" @default.
- W3089628143 workType "article" @default.