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- W3092584078 abstract "The aim of this paper is to analyze the SiC MOSFETs behavior under repetitive short circuit tests. In particular, the activity is focused on a deep evaluation of short circuit dynamic by dedicated laboratory measurements conducted at different conditions supported and compared by means of a robust physical model developed by Finite Element Approach (FEA) and Failure Analysis (FA)." @default.
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- W3092584078 date "2020-09-01" @default.
- W3092584078 modified "2023-10-06" @default.
- W3092584078 title "Thermal Model Development for SiC MOSFETs Robustness Analysis under Repetitive Short Circuit Tests" @default.
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- W3092584078 doi "https://doi.org/10.23919/epe20ecceeurope43536.2020.9215664" @default.
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