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• W3099814196 abstract "We propose a flat, analytic, mixed-size placement algorithm ePlace-3D for three-dimension integrated circuits (3D-ICs) using nonlinear optimization. Our contributions are (1) electrostatics based 3D density function with globally uniform smoothness (2) 3D numerical solution with improved spectral formulation (3) 3D nonlinear pre-conditioner for convergence acceleration (4) interleaved 2D-3D placement for efficiency enhancement. Our placer outperforms the leading work mPL6-3D and NTUplace3-3D with 6.44% and 37.15% shorter wirelength, 9.11% and 10.27% fewer 3D vertical interconnects (VI) on average of IBM-PLACE circuits. Validation on the large-scale modern mixed-size (MMS) 3D circuits shows high performance and scalability." @default.
• W3099814196 created "2020-11-23" @default.
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• W3099814196 date "2016-04-03" @default.
• W3099814196 modified "2023-10-01" @default.
• W3099814196 title "ePlace-3D" @default.
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• W3099814196 doi "https://doi.org/10.1145/2872334.2872361" @default.
• W3099814196 hasPublicationYear "2016" @default.
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