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• W3102908906 endingPage "025304" @default.
• W3102908906 startingPage "025304" @default.
• W3102908906 abstract "We report a new method for introducing metal atoms into silicon wafers, using negligible thermal budget. Molecular thin films are irradiated with ultra-violet light releasing metal species into the semiconductor substrate. Secondary ion mass spectrometry and x-ray absorption spectroscopy show that Mn is incorporated into Si as an interstitial dopant. We propose that our method can form the basis of a generic low-cost, low-temperature technology that could lead to the creation of ordered dopant arrays." @default.
• W3102908906 created "2020-11-23" @default.
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• W3102908906 date "2009-12-03" @default.
• W3102908906 modified "2023-10-02" @default.
• W3102908906 title "A novel route for the inclusion of metal dopants in silicon" @default.
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• W3102908906 doi "https://doi.org/10.1088/0957-4484/21/2/025304" @default.
• W3102908906 hasPubMedId "https://pubmed.ncbi.nlm.nih.gov/19955611" @default.
• W3102908906 hasPublicationYear "2009" @default.
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