FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W3105494443> ?p ?o ?g. }

• W3105494443 endingPage "111481" @default.
• W3105494443 startingPage "111481" @default.
• W3105494443 abstract "Microlens array (MLA) is applied widely in imaging, lighting, and sensing fields. Among the many techniques for MLA fabrication, molding is considered to be a mass-production method with low-cost and good accuracy. Silicon carbide (SiC), which has a high mechanical hardness, high thermal conductivity, and low thermal expansion coefficient, is an ideal mold material. But to fabricate microlens array on SiC by the mechanical method is a challenging issue because of its high brittleness and hardness. In this study, a novel method is proposed and developed, in which we use self-assembled silica microspheres monolayer as a template for SU8 resist patterning, subsequently producing concave MLAs in the SiC substrates by Inductively Coupled Plasma (ICP) etching. Two sizes of hexagonal MLAs (diameter Φ11 μm and height 0.8 μm, diameter Φ33 μm and height 2.9 μm, respectively) have been created and tested to possess good imaging performance." @default.
• W3105494443 created "2020-11-23" @default.
• W3105494443 creator A5052962241 @default.
• W3105494443 creator A5059335875 @default.
• W3105494443 creator A5072693668 @default.
• W3105494443 date "2021-02-01" @default.
• W3105494443 modified "2023-10-18" @default.
• W3105494443 title "Fabrication of SiC concave microlens array mold based on microspheres self-assembly" @default.
• W3105494443 cites W1978747573 @default.
• W3105494443 cites W1989735196 @default.
• W3105494443 cites W2007272217 @default.
• W3105494443 cites W2024977515 @default.
• W3105494443 cites W2025466987 @default.
• W3105494443 cites W2032022785 @default.
• W3105494443 cites W2037121187 @default.
• W3105494443 cites W2042822987 @default.
• W3105494443 cites W2047086134 @default.
• W3105494443 cites W2049989245 @default.
• W3105494443 cites W2069507241 @default.
• W3105494443 cites W2083926622 @default.
• W3105494443 cites W2085601976 @default.
• W3105494443 cites W2091537368 @default.
• W3105494443 cites W2118879658 @default.
• W3105494443 cites W2156124784 @default.
• W3105494443 cites W2495124819 @default.
• W3105494443 cites W2507231372 @default.
• W3105494443 cites W2565609764 @default.
• W3105494443 cites W2588018980 @default.
• W3105494443 cites W2603742623 @default.
• W3105494443 cites W2605155855 @default.
• W3105494443 cites W2758220617 @default.
• W3105494443 cites W2760706646 @default.
• W3105494443 cites W2766894780 @default.
• W3105494443 cites W2789655334 @default.
• W3105494443 cites W2791713863 @default.
• W3105494443 cites W2791768082 @default.
• W3105494443 cites W2797219557 @default.
• W3105494443 cites W2884639978 @default.
• W3105494443 cites W2889403176 @default.
• W3105494443 cites W2894575390 @default.
• W3105494443 cites W2903438718 @default.
• W3105494443 cites W2947472477 @default.
• W3105494443 cites W3000481898 @default.
• W3105494443 cites W3004949858 @default.
• W3105494443 cites W876830954 @default.
• W3105494443 doi "https://doi.org/10.1016/j.mee.2020.111481" @default.
• W3105494443 hasPublicationYear "2021" @default.
• W3105494443 type Work @default.
• W3105494443 sameAs 3105494443 @default.
• W3105494443 citedByCount "4" @default.
• W3105494443 countsByYear W31054944432021 @default.
• W3105494443 countsByYear W31054944432022 @default.
• W3105494443 countsByYear W31054944432023 @default.
• W3105494443 crossrefType "journal-article" @default.
• W3105494443 hasAuthorship W3105494443A5052962241 @default.
• W3105494443 hasAuthorship W3105494443A5059335875 @default.
• W3105494443 hasAuthorship W3105494443A5072693668 @default.
• W3105494443 hasConcept C100460472 @default.
• W3105494443 hasConcept C120665830 @default.
• W3105494443 hasConcept C121332964 @default.
• W3105494443 hasConcept C136525101 @default.
• W3105494443 hasConcept C142724271 @default.
• W3105494443 hasConcept C15336307 @default.
• W3105494443 hasConcept C159985019 @default.
• W3105494443 hasConcept C171250308 @default.
• W3105494443 hasConcept C192560794 @default.
• W3105494443 hasConcept C192562407 @default.
• W3105494443 hasConcept C204787440 @default.
• W3105494443 hasConcept C2779227376 @default.
• W3105494443 hasConcept C2780566776 @default.
• W3105494443 hasConcept C2780722187 @default.
• W3105494443 hasConcept C49040817 @default.
• W3105494443 hasConcept C53524968 @default.
• W3105494443 hasConcept C544956773 @default.
• W3105494443 hasConcept C67558686 @default.
• W3105494443 hasConcept C71924100 @default.
• W3105494443 hasConcept C97346530 @default.
• W3105494443 hasConceptScore W3105494443C100460472 @default.
• W3105494443 hasConceptScore W3105494443C120665830 @default.
• W3105494443 hasConceptScore W3105494443C121332964 @default.
• W3105494443 hasConceptScore W3105494443C136525101 @default.
• W3105494443 hasConceptScore W3105494443C142724271 @default.
• W3105494443 hasConceptScore W3105494443C15336307 @default.
• W3105494443 hasConceptScore W3105494443C159985019 @default.
• W3105494443 hasConceptScore W3105494443C171250308 @default.
• W3105494443 hasConceptScore W3105494443C192560794 @default.
• W3105494443 hasConceptScore W3105494443C192562407 @default.
• W3105494443 hasConceptScore W3105494443C204787440 @default.
• W3105494443 hasConceptScore W3105494443C2779227376 @default.
• W3105494443 hasConceptScore W3105494443C2780566776 @default.
• W3105494443 hasConceptScore W3105494443C2780722187 @default.
• W3105494443 hasConceptScore W3105494443C49040817 @default.
• W3105494443 hasConceptScore W3105494443C53524968 @default.
• W3105494443 hasConceptScore W3105494443C544956773 @default.
• W3105494443 hasConceptScore W3105494443C67558686 @default.
• W3105494443 hasConceptScore W3105494443C71924100 @default.
• W3105494443 hasConceptScore W3105494443C97346530 @default.
• W3105494443 hasFunder F4320321001 @default.

• next