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• W3108764834 abstract "Implantable neural probes represent one the most revolutionary technology of the last years, having experienced a large growth because of the wide range of applications in which they can be adopted, spacing from the treatment of neurological disease to the Internet of Things. They aim to record or stimulate the neurons activity using thin needles to be implanted into the brain cortex, with a depth and location depending on the particular device purposes. The biggest challenge for a more massive use of human machine interfaces for biomedical applications is related to the capability of developing small devices with a high density of recording/stimulation sites, able to last long in a biological medium. That happens because unconventional materials for microfabrication processes have to be used, even if micromachining is not well developed for such materials. Thus, it is the case of stainless steel used to give robustness and flexibility to devices substrates, as well as Parylene C to ensure biocompatibility and good insulation performance: both of them have been adopted to realize the devices used in this thesis work. After the fabrication process, some customization procedures need to be adopted to improve quality of the surfaces. Electropolishing and electroetching are two valide candidates for this purpose: the procedures have been implemented to get hybrid flexible/stiff devices with smooth edges, reducing the possibility to damage the recording sites or changing the electrical insulator properties. In terms of packaging, correctly interfacing the device with the electrical setup for the recording operation could be challenging due the fragility of the device itself. This operation needs to be customized in such a way that the mechanical stress for the device is minimized, without losing in signal quality, in terms of parasitics and yield of the packaging procedure. Adhesive flip chip bonding and Zero Insertion Force (ZIF) connectors have been used to obtain this result, by interfacing the probe back-end with customized flexible Printed Circuit Boards (PCBs). Then, each device needs to be electrically characterized, to ensure good performance before the in-vivo implantation or to modify the fabrication process if major problems are encountered during the result analysis. Electrochemical Impedance Spectroscopy (EIS) is the technique adopted in this thesis work to analyze both the response of one single recording site and the crosstalk effects between two traces. The implemented setup uses a PCB board to switch between all the probe channels, resulting in an automatic routine that makes the process fast and increases reliability. Another important aspect of implantable devices characterization is the estimation of the mean time to failure after the insertion in a biological tissue. The device aging has been artificially carried on and the probe electrical properties have been analyzed over time starting from different aging conditions. Finally, the last step of the characterization is to test how each recording site responds to an electrical stimulus that emulates the neuron activity, before performing the in-vivo characterization directly on animals brain." @default.
• W3108764834 created "2020-12-07" @default.
• W3108764834 creator A5020232802 @default.
• W3108764834 date "2020-03-30" @default.
• W3108764834 modified "2023-09-27" @default.
• W3108764834 title "Electrochemical processing, packaging and characterization of high-density implantable neural probes for in-vivo recording" @default.
• W3108764834 hasPublicationYear "2020" @default.
• W3108764834 type Work @default.
• W3108764834 sameAs 3108764834 @default.
• W3108764834 citedByCount "0" @default.
• W3108764834 crossrefType "journal-article" @default.
• W3108764834 hasAuthorship W3108764834A5020232802 @default.
• W3108764834 hasConcept C119599485 @default.
• W3108764834 hasConcept C127413603 @default.
• W3108764834 hasConcept C136229726 @default.
• W3108764834 hasConcept C136525101 @default.
• W3108764834 hasConcept C138331895 @default.
• W3108764834 hasConcept C142724271 @default.
• W3108764834 hasConcept C147789679 @default.
• W3108764834 hasConcept C149635348 @default.
• W3108764834 hasConcept C171250308 @default.
• W3108764834 hasConcept C17525397 @default.
• W3108764834 hasConcept C185592680 @default.
• W3108764834 hasConcept C192562407 @default.
• W3108764834 hasConcept C204787440 @default.
• W3108764834 hasConcept C2776303644 @default.
• W3108764834 hasConcept C2777848306 @default.
• W3108764834 hasConcept C41008148 @default.
• W3108764834 hasConcept C527607 @default.
• W3108764834 hasConcept C68801617 @default.
• W3108764834 hasConcept C71924100 @default.
• W3108764834 hasConcept C9390403 @default.
• W3108764834 hasConceptScore W3108764834C119599485 @default.
• W3108764834 hasConceptScore W3108764834C127413603 @default.
• W3108764834 hasConceptScore W3108764834C136229726 @default.
• W3108764834 hasConceptScore W3108764834C136525101 @default.
• W3108764834 hasConceptScore W3108764834C138331895 @default.
• W3108764834 hasConceptScore W3108764834C142724271 @default.
• W3108764834 hasConceptScore W3108764834C147789679 @default.
• W3108764834 hasConceptScore W3108764834C149635348 @default.
• W3108764834 hasConceptScore W3108764834C171250308 @default.
• W3108764834 hasConceptScore W3108764834C17525397 @default.
• W3108764834 hasConceptScore W3108764834C185592680 @default.
• W3108764834 hasConceptScore W3108764834C192562407 @default.
• W3108764834 hasConceptScore W3108764834C204787440 @default.
• W3108764834 hasConceptScore W3108764834C2776303644 @default.
• W3108764834 hasConceptScore W3108764834C2777848306 @default.
• W3108764834 hasConceptScore W3108764834C41008148 @default.
• W3108764834 hasConceptScore W3108764834C527607 @default.
• W3108764834 hasConceptScore W3108764834C68801617 @default.
• W3108764834 hasConceptScore W3108764834C71924100 @default.
• W3108764834 hasConceptScore W3108764834C9390403 @default.
• W3108764834 hasLocation W31087648341 @default.
• W3108764834 hasOpenAccess W3108764834 @default.
• W3108764834 hasPrimaryLocation W31087648341 @default.
• W3108764834 hasRelatedWork W1604153491 @default.
• W3108764834 hasRelatedWork W2039205079 @default.
• W3108764834 hasRelatedWork W2039655444 @default.
• W3108764834 hasRelatedWork W2070219691 @default.
• W3108764834 hasRelatedWork W2077630949 @default.
• W3108764834 hasRelatedWork W2108394803 @default.
• W3108764834 hasRelatedWork W2128073322 @default.
• W3108764834 hasRelatedWork W2493304482 @default.
• W3108764834 hasRelatedWork W2752783240 @default.
• W3108764834 hasRelatedWork W2776524789 @default.
• W3108764834 hasRelatedWork W2947849579 @default.
• W3108764834 hasRelatedWork W2973243189 @default.
• W3108764834 hasRelatedWork W2978755646 @default.
• W3108764834 hasRelatedWork W3000678720 @default.
• W3108764834 hasRelatedWork W3016687100 @default.
• W3108764834 hasRelatedWork W3138845854 @default.
• W3108764834 hasRelatedWork W89518510 @default.
• W3108764834 hasRelatedWork W230468632 @default.
• W3108764834 hasRelatedWork W2603618637 @default.
• W3108764834 hasRelatedWork W3178697505 @default.
• W3108764834 isParatext "false" @default.
• W3108764834 isRetracted "false" @default.
• W3108764834 magId "3108764834" @default.
• W3108764834 workType "article" @default.