Matches in SemOpenAlex for { <https://semopenalex.org/work/W3109929863> ?p ?o ?g. }
Showing items 1 to 59 of
59
with 100 items per page.
- W3109929863 abstract "In order to following Moore’s law, scaling down and piling up of chips through packaging processes are the most popular solution to raise performance of chips. So far, packaging in two-dimension (2D) tends to transform into 2.5D or 3D and even other novel and special structures. Due to the improvement of packaging technology, solder joints must shrink from about hundred to ten microns. The destructive analysis of reliability tests and failures will meet some troubles for small size of joints. Therefore, non-destructive inspection seems to be a good way for analysis. For the images of computed tomography (CT) done by X-ray, any view angles of joint array can be observed. The image can not only show the cross section of a row of joints but also check the distribution of failures for the advantage of CT technology.The reliability tests including temperature cycling test (TCT), high accelerated stress test (HAST), and electromigration (EM) are the common methods for improving the process or the design of structures. The size of solder microbumps will cause high current density for small cross section of joints, so the influence of EM becomes a big issue. With high current density, copper or nickel atoms will diffuse through interstitial site of tin, and cause the formation of voids and intermetallic compounds (IMCs). There are many factors affect the failure modes during EM test, such as the diffusivity of the materials in under bump metallurgy (UBM) and the tin grain orientation. Immortal microbumps might happen for the full IMCs joints. As a result, Voids formation is the most important failure mode during EM test. In the current study, the EM failures of microbumps were observed through 3D X-ray during various stages of EM, and evolution of voids can be examined." @default.
- W3109929863 created "2020-12-07" @default.
- W3109929863 creator A5039650381 @default.
- W3109929863 creator A5078790825 @default.
- W3109929863 creator A5080144455 @default.
- W3109929863 creator A5080479396 @default.
- W3109929863 date "2020-10-21" @default.
- W3109929863 modified "2023-09-24" @default.
- W3109929863 title "Study of Electromigration of Solder Microbumps by 3D X-ray Microscopy" @default.
- W3109929863 doi "https://doi.org/10.1109/impact50485.2020.9268536" @default.
- W3109929863 hasPublicationYear "2020" @default.
- W3109929863 type Work @default.
- W3109929863 sameAs 3109929863 @default.
- W3109929863 citedByCount "2" @default.
- W3109929863 countsByYear W31099298632022 @default.
- W3109929863 countsByYear W31099298632023 @default.
- W3109929863 crossrefType "proceedings-article" @default.
- W3109929863 hasAuthorship W3109929863A5039650381 @default.
- W3109929863 hasAuthorship W3109929863A5078790825 @default.
- W3109929863 hasAuthorship W3109929863A5080144455 @default.
- W3109929863 hasAuthorship W3109929863A5080479396 @default.
- W3109929863 hasConcept C120665830 @default.
- W3109929863 hasConcept C121332964 @default.
- W3109929863 hasConcept C138055206 @default.
- W3109929863 hasConcept C147080431 @default.
- W3109929863 hasConcept C159985019 @default.
- W3109929863 hasConcept C191897082 @default.
- W3109929863 hasConcept C192562407 @default.
- W3109929863 hasConcept C2779328170 @default.
- W3109929863 hasConcept C49040817 @default.
- W3109929863 hasConcept C50296614 @default.
- W3109929863 hasConceptScore W3109929863C120665830 @default.
- W3109929863 hasConceptScore W3109929863C121332964 @default.
- W3109929863 hasConceptScore W3109929863C138055206 @default.
- W3109929863 hasConceptScore W3109929863C147080431 @default.
- W3109929863 hasConceptScore W3109929863C159985019 @default.
- W3109929863 hasConceptScore W3109929863C191897082 @default.
- W3109929863 hasConceptScore W3109929863C192562407 @default.
- W3109929863 hasConceptScore W3109929863C2779328170 @default.
- W3109929863 hasConceptScore W3109929863C49040817 @default.
- W3109929863 hasConceptScore W3109929863C50296614 @default.
- W3109929863 hasFunder F4320322108 @default.
- W3109929863 hasLocation W31099298631 @default.
- W3109929863 hasOpenAccess W3109929863 @default.
- W3109929863 hasPrimaryLocation W31099298631 @default.
- W3109929863 hasRelatedWork W1528005912 @default.
- W3109929863 hasRelatedWork W2024392927 @default.
- W3109929863 hasRelatedWork W2029363190 @default.
- W3109929863 hasRelatedWork W2046947255 @default.
- W3109929863 hasRelatedWork W2071030926 @default.
- W3109929863 hasRelatedWork W2089932749 @default.
- W3109929863 hasRelatedWork W2294065497 @default.
- W3109929863 hasRelatedWork W2896398390 @default.
- W3109929863 hasRelatedWork W2991870636 @default.
- W3109929863 hasRelatedWork W3023501383 @default.
- W3109929863 isParatext "false" @default.
- W3109929863 isRetracted "false" @default.
- W3109929863 magId "3109929863" @default.
- W3109929863 workType "article" @default.