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• W3111157830 abstract "Metalized polypropylene films are widely used as dielectric materials in self-healing (SH) power capacitors due to its higher operation electric field, and the SH properties of metalized film directly decided the performance of capacitors. Among all the film parameters, the effects of sheet resistance (R <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>s</sub> , the ratio of metal resistivity ρ to metal thickness d, R <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>s</sub> =ρ/d) played the dominant role, that the higher R <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>s</sub> usually resulted in the better SH performance. As a result, in the present study the SH properties of metalized polypropylene film with elevated R <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>s</sub> were investigated. The morphology of evaporated area of sample films were observed, and four parameters, the dissipated energy (W <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>sh</sub> ), the evaporation area (S <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>v</sub> ), the peak value of short circuit current (I <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>m</sub> ) and the duration time (τ) were selected to characterize the SH performance. Results showed that electric explosion was more likely to happen during SH process when R <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>s</sub> was higher than 35 Ω, which might threaten the stable operation of capacitors. Besides, W <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>sh</sub> , S <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>v</sub> , I <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>m</sub> and τ all decreased with the increase of R <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>s</sub> , benefiting the SH process, but the benefits reduced at high R <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>s</sub> level. Considering the higher dielectric losses and financial costs brought by the elevated R <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>s</sub> , an appropriate R <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>s</sub> of 35 Ω was recommended." @default.
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• W3111157830 date "2020-09-06" @default.
• W3111157830 modified "2023-10-17" @default.
• W3111157830 title "Self-healing Properties of Metalized Polypropylene Film with Elevated Sheet Resistance" @default.
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• W3111157830 doi "https://doi.org/10.1109/ichve49031.2020.9279759" @default.
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