FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W3119373389> ?p ?o ?g. }

• W3119373389 endingPage "116585" @default.
• W3119373389 startingPage "116585" @default.
• W3119373389 abstract "Thermal management is one of the major challenges facing the development of three-dimensional (3D) chip stacks. Recently, experimental studies have shown that neck-based thermal structure (NTS) between chip layers formed by drying of colloidal suspension in cavity filled with micro-size particles can improve the vertical heat conduction threefold. However, a deep understanding of the mechanisms of neck formation and its influence on heat conduction is still lacking. In this paper, we numerically study the effects of three parameters, i.e., initial nanoparticle concentration, drying temperature and chip surface wettability on neck formation between filler particles and on the resulting heat conduction of the NTS. With increasing nanoparticle concentration, the size and number of necks increase, resulting in an increased effective thermal conductivity (ETC) of NTS. The drying temperature is found to have only little influence on the ETC of resultant NTS, while the neck size and spatial distribution become more uniform at higher drying temperature. When reducing the wettability of the top and bottom surfaces of the cavity, the necks shrink in size until completing evacuating at the top and bottom layers, while the size of the necks between filler particles in the middle height of the cavity expands slowly. In consequence, the ETC of NTS drops at an increasing rate. Being able to reveal the underlying multiple mechanisms of two-phase flow, phase change and heat transport, the current numerical study suggests optimal values for the deposition process, with initial nanoparticle concentration over 0.8%, a drying temperature of 60°C and a uniform contact angle of 30° for practical production of NTS." @default.
• W3119373389 created "2021-01-18" @default.
• W3119373389 creator A5034679430 @default.
• W3119373389 creator A5036585974 @default.
• W3119373389 creator A5057035908 @default.
• W3119373389 creator A5059810716 @default.
• W3119373389 creator A5066741432 @default.
• W3119373389 creator A5081044130 @default.
• W3119373389 date "2021-03-01" @default.
• W3119373389 modified "2023-10-16" @default.
• W3119373389 title "Three influential factors on colloidal nanoparticle deposition for heat conduction enhancement in 3D chip stacks" @default.
• W3119373389 cites W1989234419 @default.
• W3119373389 cites W2001870828 @default.
• W3119373389 cites W2005721275 @default.
• W3119373389 cites W2009064898 @default.
• W3119373389 cites W2028335471 @default.
• W3119373389 cites W2033642666 @default.
• W3119373389 cites W2049426825 @default.
• W3119373389 cites W2049472804 @default.
• W3119373389 cites W2050207962 @default.
• W3119373389 cites W2059824169 @default.
• W3119373389 cites W2059970198 @default.
• W3119373389 cites W2068424943 @default.
• W3119373389 cites W2069822079 @default.
• W3119373389 cites W2076981108 @default.
• W3119373389 cites W2103618972 @default.
• W3119373389 cites W2104559059 @default.
• W3119373389 cites W2110876094 @default.
• W3119373389 cites W2114415166 @default.
• W3119373389 cites W2136769255 @default.
• W3119373389 cites W2140020798 @default.
• W3119373389 cites W2141435781 @default.
• W3119373389 cites W2152474536 @default.
• W3119373389 cites W2153513624 @default.
• W3119373389 cites W2156259175 @default.
• W3119373389 cites W2161811264 @default.
• W3119373389 cites W2162794541 @default.
• W3119373389 cites W2166776469 @default.
• W3119373389 cites W2316223394 @default.
• W3119373389 cites W2316603401 @default.
• W3119373389 cites W2326822335 @default.
• W3119373389 cites W2489217217 @default.
• W3119373389 cites W2497175194 @default.
• W3119373389 cites W2509117982 @default.
• W3119373389 cites W2511836138 @default.
• W3119373389 cites W2530341391 @default.
• W3119373389 cites W2540704678 @default.
• W3119373389 cites W2573926654 @default.
• W3119373389 cites W2605976828 @default.
• W3119373389 cites W2744119060 @default.
• W3119373389 cites W2752264911 @default.
• W3119373389 cites W2756249281 @default.
• W3119373389 cites W2770555237 @default.
• W3119373389 cites W2789556605 @default.
• W3119373389 cites W2793523040 @default.
• W3119373389 cites W2794966969 @default.
• W3119373389 cites W2802125517 @default.
• W3119373389 cites W2921855503 @default.
• W3119373389 cites W2927152365 @default.
• W3119373389 cites W2946810467 @default.
• W3119373389 cites W3035287560 @default.
• W3119373389 cites W3106170021 @default.
• W3119373389 cites W336436549 @default.
• W3119373389 cites W4252610978 @default.
• W3119373389 doi "https://doi.org/10.1016/j.applthermaleng.2021.116585" @default.
• W3119373389 hasPublicationYear "2021" @default.
• W3119373389 type Work @default.
• W3119373389 sameAs 3119373389 @default.
• W3119373389 citedByCount "4" @default.
• W3119373389 countsByYear W31193733892021 @default.
• W3119373389 countsByYear W31193733892022 @default.
• W3119373389 countsByYear W31193733892023 @default.
• W3119373389 crossrefType "journal-article" @default.
• W3119373389 hasAuthorship W3119373389A5034679430 @default.
• W3119373389 hasAuthorship W3119373389A5036585974 @default.
• W3119373389 hasAuthorship W3119373389A5057035908 @default.
• W3119373389 hasAuthorship W3119373389A5059810716 @default.
• W3119373389 hasAuthorship W3119373389A5066741432 @default.
• W3119373389 hasAuthorship W3119373389A5081044130 @default.
• W3119373389 hasBestOaLocation W31193733891 @default.
• W3119373389 hasConcept C121332964 @default.
• W3119373389 hasConcept C127413603 @default.
• W3119373389 hasConcept C134514944 @default.
• W3119373389 hasConcept C151730666 @default.
• W3119373389 hasConcept C155672457 @default.
• W3119373389 hasConcept C159985019 @default.
• W3119373389 hasConcept C171250308 @default.
• W3119373389 hasConcept C172100665 @default.
• W3119373389 hasConcept C187530423 @default.
• W3119373389 hasConcept C192562407 @default.
• W3119373389 hasConcept C204530211 @default.
• W3119373389 hasConcept C2816523 @default.
• W3119373389 hasConcept C42360764 @default.
• W3119373389 hasConcept C64297162 @default.
• W3119373389 hasConcept C86803240 @default.
• W3119373389 hasConcept C97346530 @default.
• W3119373389 hasConcept C97355855 @default.
• W3119373389 hasConceptScore W3119373389C121332964 @default.

• next