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- W3119646372 abstract "Gold electrode is preferable in extreme environments, but few reports focus on gold electrode for LTCC application. In this article, CaO–B 2 O 3 –SiO 2 glass powder used in the gold paste with different particle size was prepared. The sintering shrinkage behavior of CaO–B 2 O 3 –SiO 2 green tapes and gold paste were investigated. The blisters of gold electrode and corresponding mechanism during sintering process were studied. The sheet resistivity and wire bonding strength of gold electrode were connected with glass particle size strongly. When the D 50 of CaO–B 2 O 3 –SiO 2 glass powder was 2.61 μm, the wire bonding performance of gold electrode was excellent, of which the average strengths and standard deviation of wire bonding were 10.30 g and 0.66 g, respectively. These results would have a positive effect on guiding the select of glass particle size in gold paste. • The glass of gold paste with smaller particle size could flow down to the interface of Au/ceramic structure more easily and exhibit more uniformly distributed in gold circuit, which would reduce the sheet resistivity of gold circuit, increase the average strength and stability of wire bonding in samples. • The excessive small particle size of glass in paste, would lead to the blister of gold circuit. • The blister of gold circuit was decrease the conductivity and damage the strength and stability of wire bonding of gold circuit." @default.
- W3119646372 created "2021-01-18" @default.
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- W3119646372 date "2021-02-01" @default.
- W3119646372 modified "2023-10-14" @default.
- W3119646372 title "The influence of glass particle size on the interfacial bonding strength of Au/ceramic co-fired structure" @default.
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- W3119646372 doi "https://doi.org/10.1016/j.microrel.2021.114039" @default.
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