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• W3121420121 endingPage "138553" @default.
• W3121420121 startingPage "138553" @default.
• W3121420121 abstract "Abstract The deposition processes of Cu atoms onto Si substrate are studied in atomic-scale molecular dynamics (MD) simulation. Our aim here is to check how the microstructure properties of Cu thin film are affected by the incident angles. To this end, we have adopted various analytical techniques such as surface roughness, layer coverage, film density, and internal stress. Our results show that at low incident angles ( 0 ∘ − 45 ∘ ) , the deposition of Cu atoms on the substrate generates a compact and uniform thin film with approximately a smooth surface. However, at higher incident angles ( 60 ∘ − 85 ∘ ) the effects become more pronounced, where the thin film morphology is changed from a dense structure to a columnar structure with more voids and vacancies. The surface roughness was also significantly increased as the incident angle increases. On the other hand, the analysis of interface mixing revealed that there are little effects of the deposition angles on the film-substrate mixing, and the penetration of Cu atoms onto Si substrate is limited to the two first upper layers. In the same context, our calculations show that the film density decreases significantly along the growth direction when the incident angles are above 60 ∘ . Finally, the result of residual stress after the deposition process demonstrates that the film has compressive stress at low incident angles, but it changed to tensile stress when deposition angles exceed 60 ∘ ." @default.
• W3121420121 created "2021-02-01" @default.
• W3121420121 creator A5050872426 @default.
• W3121420121 creator A5074150899 @default.
• W3121420121 creator A5075784420 @default.
• W3121420121 date "2021-03-01" @default.
• W3121420121 modified "2023-10-06" @default.
• W3121420121 title "Effect of incident angle on the microstructure proprieties of Cu thin film deposited on Si (001) substrate" @default.
• W3121420121 cites W1930272518 @default.
• W3121420121 cites W1963989017 @default.
• W3121420121 cites W1968398817 @default.
• W3121420121 cites W1968471476 @default.
• W3121420121 cites W1970999802 @default.
• W3121420121 cites W1983578384 @default.
• W3121420121 cites W1984319292 @default.
• W3121420121 cites W1987805929 @default.
• W3121420121 cites W1992593583 @default.
• W3121420121 cites W1997014477 @default.
• W3121420121 cites W2003507154 @default.
• W3121420121 cites W2004017561 @default.
• W3121420121 cites W2004811627 @default.
• W3121420121 cites W2005594174 @default.
• W3121420121 cites W2007387568 @default.
• W3121420121 cites W2008634724 @default.
• W3121420121 cites W2010578988 @default.
• W3121420121 cites W2011835404 @default.
• W3121420121 cites W2018555361 @default.
• W3121420121 cites W2019465613 @default.
• W3121420121 cites W2020857226 @default.
• W3121420121 cites W2022226353 @default.
• W3121420121 cites W2022533640 @default.
• W3121420121 cites W2024946571 @default.
• W3121420121 cites W2033193531 @default.
• W3121420121 cites W2034743469 @default.
• W3121420121 cites W2039078016 @default.
• W3121420121 cites W2041329295 @default.
• W3121420121 cites W2044004836 @default.
• W3121420121 cites W2047415325 @default.
• W3121420121 cites W2049127619 @default.
• W3121420121 cites W2056562008 @default.
• W3121420121 cites W2056999869 @default.
• W3121420121 cites W2060211502 @default.
• W3121420121 cites W2063693965 @default.
• W3121420121 cites W2075799695 @default.
• W3121420121 cites W2081432963 @default.
• W3121420121 cites W2089790326 @default.
• W3121420121 cites W2093408112 @default.
• W3121420121 cites W2104531041 @default.
• W3121420121 cites W2108158611 @default.
• W3121420121 cites W2125514929 @default.
• W3121420121 cites W2147415793 @default.
• W3121420121 cites W2170080421 @default.
• W3121420121 cites W2196457678 @default.
• W3121420121 cites W2415374455 @default.
• W3121420121 cites W2467388528 @default.
• W3121420121 cites W2789517172 @default.
• W3121420121 cites W2796009064 @default.
• W3121420121 cites W2981158721 @default.
• W3121420121 cites W2982521802 @default.
• W3121420121 cites W3006155100 @default.
• W3121420121 cites W3010633449 @default.
• W3121420121 doi "https://doi.org/10.1016/j.tsf.2021.138553" @default.
• W3121420121 hasPublicationYear "2021" @default.
• W3121420121 type Work @default.
• W3121420121 sameAs 3121420121 @default.
• W3121420121 citedByCount "6" @default.
• W3121420121 countsByYear W31214201212022 @default.
• W3121420121 countsByYear W31214201212023 @default.
• W3121420121 crossrefType "journal-article" @default.
• W3121420121 hasAuthorship W3121420121A5050872426 @default.
• W3121420121 hasAuthorship W3121420121A5074150899 @default.
• W3121420121 hasAuthorship W3121420121A5075784420 @default.
• W3121420121 hasConcept C111368507 @default.
• W3121420121 hasConcept C120665830 @default.
• W3121420121 hasConcept C121332964 @default.
• W3121420121 hasConcept C127313418 @default.
• W3121420121 hasConcept C127413603 @default.
• W3121420121 hasConcept C159985019 @default.
• W3121420121 hasConcept C171250308 @default.
• W3121420121 hasConcept C19067145 @default.
• W3121420121 hasConcept C192562407 @default.
• W3121420121 hasConcept C2777289219 @default.
• W3121420121 hasConcept C42360764 @default.
• W3121420121 hasConcept C87976508 @default.
• W3121420121 hasConceptScore W3121420121C111368507 @default.
• W3121420121 hasConceptScore W3121420121C120665830 @default.
• W3121420121 hasConceptScore W3121420121C121332964 @default.
• W3121420121 hasConceptScore W3121420121C127313418 @default.
• W3121420121 hasConceptScore W3121420121C127413603 @default.
• W3121420121 hasConceptScore W3121420121C159985019 @default.
• W3121420121 hasConceptScore W3121420121C171250308 @default.
• W3121420121 hasConceptScore W3121420121C19067145 @default.
• W3121420121 hasConceptScore W3121420121C192562407 @default.
• W3121420121 hasConceptScore W3121420121C2777289219 @default.
• W3121420121 hasConceptScore W3121420121C42360764 @default.
• W3121420121 hasConceptScore W3121420121C87976508 @default.
• W3121420121 hasLocation W31214201211 @default.
• W3121420121 hasOpenAccess W3121420121 @default.

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