FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W3123111611> ?p ?o ?g. }

• W3123111611 endingPage "114041" @default.
• W3123111611 startingPage "114041" @default.
• W3123111611 abstract "Bi additions have been reported to improve the wettability and drop-impact performance. Most important of all, it improves the mechanical properties. However, few studies focus on the effect of the Bi addition on mechanical properties and microstructure of intermetallic compounds (IMCs) in solder balls, especially on those properties after current stressing. In this study, to understand the effect of Bi addition, a lead-free Sn-3Ag-0.5Cu-xBi (SAC305-Bi) solder joint with Bi additions from 1 to 3 wt% was used to investigate mechanical property of Sn-rich matrix and microstructure of IMCs in the solder joint after current stressing process. We combined nanoindentation, scanning electron microscope (SEM), energy-dispersive X-ray spectroscopy (EDS) and electron backscatter diffraction (EBSD) to analyze mechanical property, and observe the intermetallic compounds of Cu3Sn, and Cu6Sn5 at the interface. The mechanical properties of hardness in Sn matrix is improved by the amount of Bi, where the hardness increases from 0.095 to 0.141 GPa as increasing Bi addition from 1 to 3 wt%. In addition, the growth rate constant of intermetallic compounds of Cu3Sn is in the range between 0.175 and 0.256, that is, Cu3Sn is not sensitive to Bi addition. Furthermore, the amount of doping Bi addition enhances the growth rate Cu6Sn5, as the rate constant increases from 1.597 to 2.413 with increasing Bi addition from 1 to 3 wt%." @default.
• W3123111611 created "2021-02-01" @default.
• W3123111611 creator A5022735282 @default.
• W3123111611 creator A5025526333 @default.
• W3123111611 creator A5029417415 @default.
• W3123111611 creator A5036452314 @default.
• W3123111611 creator A5052191979 @default.
• W3123111611 creator A5070514107 @default.
• W3123111611 creator A5088102308 @default.
• W3123111611 date "2021-02-01" @default.
• W3123111611 modified "2023-10-18" @default.
• W3123111611 title "Effects of bismuth additions on mechanical property and microstructure of SAC-Bi solder joint under current stressing" @default.
• W3123111611 cites W1976738376 @default.
• W3123111611 cites W1976868397 @default.
• W3123111611 cites W1983782474 @default.
• W3123111611 cites W1989737343 @default.
• W3123111611 cites W1993115060 @default.
• W3123111611 cites W1993344158 @default.
• W3123111611 cites W1999298376 @default.
• W3123111611 cites W2004018784 @default.
• W3123111611 cites W2015314323 @default.
• W3123111611 cites W2016354817 @default.
• W3123111611 cites W2020252669 @default.
• W3123111611 cites W2026079340 @default.
• W3123111611 cites W2040743544 @default.
• W3123111611 cites W2044358827 @default.
• W3123111611 cites W2058751597 @default.
• W3123111611 cites W2060042685 @default.
• W3123111611 cites W2064782593 @default.
• W3123111611 cites W2065273895 @default.
• W3123111611 cites W2066358498 @default.
• W3123111611 cites W2068777327 @default.
• W3123111611 cites W2081819746 @default.
• W3123111611 cites W2089170185 @default.
• W3123111611 cites W2090790436 @default.
• W3123111611 cites W2100790326 @default.
• W3123111611 cites W2133900608 @default.
• W3123111611 cites W2160364749 @default.
• W3123111611 cites W2226940930 @default.
• W3123111611 cites W2334959979 @default.
• W3123111611 cites W2421549311 @default.
• W3123111611 cites W2563111050 @default.
• W3123111611 cites W2585253396 @default.
• W3123111611 cites W2760119174 @default.
• W3123111611 cites W2805670203 @default.
• W3123111611 cites W2897804836 @default.
• W3123111611 cites W2951296256 @default.
• W3123111611 doi "https://doi.org/10.1016/j.microrel.2021.114041" @default.
• W3123111611 hasPublicationYear "2021" @default.
• W3123111611 type Work @default.
• W3123111611 sameAs 3123111611 @default.
• W3123111611 citedByCount "5" @default.
• W3123111611 countsByYear W31231116112021 @default.
• W3123111611 countsByYear W31231116112022 @default.
• W3123111611 countsByYear W31231116112023 @default.
• W3123111611 crossrefType "journal-article" @default.
• W3123111611 hasAuthorship W3123111611A5022735282 @default.
• W3123111611 hasAuthorship W3123111611A5025526333 @default.
• W3123111611 hasAuthorship W3123111611A5029417415 @default.
• W3123111611 hasAuthorship W3123111611A5036452314 @default.
• W3123111611 hasAuthorship W3123111611A5052191979 @default.
• W3123111611 hasAuthorship W3123111611A5070514107 @default.
• W3123111611 hasAuthorship W3123111611A5088102308 @default.
• W3123111611 hasConcept C134514944 @default.
• W3123111611 hasConcept C147438087 @default.
• W3123111611 hasConcept C159985019 @default.
• W3123111611 hasConcept C191897082 @default.
• W3123111611 hasConcept C192562407 @default.
• W3123111611 hasConcept C26771246 @default.
• W3123111611 hasConcept C27501479 @default.
• W3123111611 hasConcept C2780026712 @default.
• W3123111611 hasConcept C27805521 @default.
• W3123111611 hasConcept C49326732 @default.
• W3123111611 hasConcept C50296614 @default.
• W3123111611 hasConcept C533668322 @default.
• W3123111611 hasConcept C87976508 @default.
• W3123111611 hasConceptScore W3123111611C134514944 @default.
• W3123111611 hasConceptScore W3123111611C147438087 @default.
• W3123111611 hasConceptScore W3123111611C159985019 @default.
• W3123111611 hasConceptScore W3123111611C191897082 @default.
• W3123111611 hasConceptScore W3123111611C192562407 @default.
• W3123111611 hasConceptScore W3123111611C26771246 @default.
• W3123111611 hasConceptScore W3123111611C27501479 @default.
• W3123111611 hasConceptScore W3123111611C2780026712 @default.
• W3123111611 hasConceptScore W3123111611C27805521 @default.
• W3123111611 hasConceptScore W3123111611C49326732 @default.
• W3123111611 hasConceptScore W3123111611C50296614 @default.
• W3123111611 hasConceptScore W3123111611C533668322 @default.
• W3123111611 hasConceptScore W3123111611C87976508 @default.
• W3123111611 hasLocation W31231116111 @default.
• W3123111611 hasOpenAccess W3123111611 @default.
• W3123111611 hasPrimaryLocation W31231116111 @default.
• W3123111611 hasRelatedWork W2006218889 @default.
• W3123111611 hasRelatedWork W2018120503 @default.
• W3123111611 hasRelatedWork W2030950743 @default.
• W3123111611 hasRelatedWork W2045519648 @default.
• W3123111611 hasRelatedWork W2053795898 @default.
• W3123111611 hasRelatedWork W2063705945 @default.

• next