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• W3123454954 endingPage "117056" @default.
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• W3123454954 abstract "[email protected] core-shell material not only has advantages of Cu and Ag elements but also inhibits Ag migration and Cu oxidation issues, showing potential in die attachments for power electronics. Currently, micro/nano sintering has been widely used for die attachments and inevitably forms residuals and voids due to solvents, leading to poor bonding strength and weak reliability. In this work, a high-temperature [email protected] solder preform was firstly fabricated by electromagnetic compaction (EMC) on [email protected] core-shell powder. Unlike conventional solder preforms, a void-free joint can be directly achieved with this [email protected] solder preform by simple thermal compression at low temperature and pressure without melting. Moreover, with the benefits of high-energy forming process, other vital properties of solder preforms, including electrical property, thermal stability, corrosion resistance and joint integrity, were also improved compared to conventional die attach materials. For instance, the corrosion potential of this [email protected] solder preform was −0.14 V, which indicates excellent corrosion resistance similar to pure Ag (−0.12 V). And no oxidation can be detected on this solder preform after storage in air for at least one year. These performance improvements were a result of enormous pressure generated instantaneously on [email protected] powder during EMC. The results showed that a flaw-free [email protected] solder preform with a high compactness of over 99 % can be successfully fabricated by appropriate compaction pressure of 13.4 MPa." @default.
• W3123454954 created "2021-02-01" @default.
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• W3123454954 date "2021-06-01" @default.
• W3123454954 modified "2023-09-25" @default.
• W3123454954 title "Fabrication and characteristics of Cu@Ag composite solder preform by electromagnetic compaction for power electronics" @default.
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• W3123454954 doi "https://doi.org/10.1016/j.jmatprotec.2021.117056" @default.
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