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- W3127011061 abstract "We present fundamental exploration of inorganic dielectric wafer-to-wafer (W2W) bonding by electron spin resonance (ESR) to assess the function of dangling bond-type interface defects. As compared to a standard PECVD SiO <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sub> which contains negligible dangling bonds (DBs), it is found that a substantial amount of silicon and carbon types of DBs, as high as 10 <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>14</sup> cm <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>-2</sup> , are present in the pre-bonding layer of SiCN and SiCO, mainly as a result of surface modification by means of low energy plasma activation prior to bonding. It is inferred that the evolution of DBs has a positive influence on improving the wafer bonding energy during post-bond anneal, in that the results suggest that a decrease of DBs translates into the formation of chemical bonds at the bonding interface." @default.
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- W3127011061 date "2020-12-02" @default.
- W3127011061 modified "2023-10-16" @default.
- W3127011061 title "Investigation of Paramagnetic Defects in SiCN and SiCO-based Wafer Bonding" @default.
- W3127011061 doi "https://doi.org/10.1109/eptc50525.2020.9315054" @default.
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