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• W3128488346 abstract "The complexity and cost of system-on-chip (SoC) designs keep increasing every year, which has progressively led to more opportunities for 2.5D System-in-Package (SiP) design. While 2.5D integration technology offers advantages for heterogeneous chiplet-based systems, it also poses challenges of a more complex overall design flow with limited EDA tools support, physical design optimization issues, interposer floor-planning difficulties and complex system-level verification. Furthermore, accurate inter-chiplet connection modeling, chiplet characterization and top-level simulation activities are also needed for comprehensive verification of SiPs. To tackle these challenges, we share an automated chiplet-based codesign flow: built on the backbone with standard EDA design tools, an automatic SiP register transfer language (RTL) generator is developed for top-level SiP netlist generation; inter-chiplet connection routing with chip assembly router and parasitic extraction tools; interposer design and bumps placement with the foundry defined redistribution layer (RDL)." @default.
• W3128488346 created "2021-02-15" @default.
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• W3128488346 date "2020-12-02" @default.
• W3128488346 modified "2023-10-16" @default.
• W3128488346 title "An Automatic Chip-Package Co-Design Flow for Multi-core Neuromorphic Computing SiPs" @default.
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• W3128488346 doi "https://doi.org/10.1109/eptc50525.2020.9315089" @default.
• W3128488346 hasPublicationYear "2020" @default.
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