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- W3133461330 endingPage "110137" @default.
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- W3133461330 abstract "Magnetron sputtering is a widely used physical vapor deposition technique. Reactive sputtering is used for the deposition of, e.g, oxides, nitrides and carbides. In fundamental research, versatility is essential when designing or upgrading a deposition chamber. Furthermore, automated deposition systems are the norm in industrial production, but relatively uncommon in laboratory-scale systems used primarily for fundamental research. Combining automatization and computerized control with the required versatility for fundamental research constitutes a challenge in designing, developing, and upgrading laboratory deposition systems. The present article provides a detailed description of the design of a lab-scale deposition chamber for magnetron sputtering used for the deposition of metallic, oxide, nitride and oxynitride films with automated controls, dc or pulsed bias, and combined with a coil to enhance the plasma density near the substrate. LabVIEW software (provided as Supplementary Information) has been developed for a high degree of computerized or automated control of hardware and processes control and logging of process details." @default.
- W3133461330 created "2021-03-01" @default.
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- W3133461330 date "2021-05-01" @default.
- W3133461330 modified "2023-10-10" @default.
- W3133461330 title "An upgraded ultra-high vacuum magnetron-sputtering system for high-versatility and software-controlled deposition" @default.
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- W3133461330 doi "https://doi.org/10.1016/j.vacuum.2021.110137" @default.
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