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- W3133966072 abstract "The integration of SMT components is necessary to produce more complex assemblies within the framework of conformable electronics. During High-Pressure-Forming (HPF) and subsequent overmolding electronic components must withstand high amounts of stress. In this study 0402- as well as 0603-sized chip resistors were mounted on different common polymer substrates using conductive adhesive paste followed by electrical and mechanical evaluation. Prior to HPF electronic components were positioned in areas of different local deformation. After HPF the specimen were characterized by shear force testing and electrical resistance measurements. In a similar manner, electronic components were tested to assess the mechanical behavior during injection molding. To examine different melt induced stress scenarios, electronic components were arranged parallel as well as perpendicular to the flow direction of the melt at different positions. Additionally, three different injection speeds were evaluated to assess the influence on the electrical conductivity and functionality of the assemblies. It was found that meandering of conductors is necessary for higher deformations. El. components (without additional nonconductive adhesives) can be placed in areas of up to 15% deformation, smaller package sizes seem to be advantageous for HPF. Regarding overmoulding, it was found that larger components (larger bonding area) is beneficial. Also, placement near the injection point, as well as low injection speeds should be avoided. Overall, el. components should be protected (using globtops / underfills etc.) to withstand consecutive HPF and overmoulding." @default.
- W3133966072 created "2021-03-15" @default.
- W3133966072 creator A5003975587 @default.
- W3133966072 creator A5051313954 @default.
- W3133966072 creator A5059197069 @default.
- W3133966072 creator A5062641399 @default.
- W3133966072 creator A5067684078 @default.
- W3133966072 creator A5075258651 @default.
- W3133966072 date "2021-02-08" @default.
- W3133966072 modified "2023-09-25" @default.
- W3133966072 title "Evaluation of Mechanical Stress on Electronic Assemblies During Thermoforming and Injection Molding for Conformable Electronics" @default.
- W3133966072 cites W1989153726 @default.
- W3133966072 cites W2078574430 @default.
- W3133966072 cites W2124087078 @default.
- W3133966072 cites W2375052763 @default.
- W3133966072 cites W2528725261 @default.
- W3133966072 cites W2549059444 @default.
- W3133966072 cites W2804564710 @default.
- W3133966072 cites W2899773016 @default.
- W3133966072 cites W2900327670 @default.
- W3133966072 cites W2902825034 @default.
- W3133966072 cites W2917965008 @default.
- W3133966072 cites W3000282301 @default.
- W3133966072 cites W3008031783 @default.
- W3133966072 cites W3027666527 @default.
- W3133966072 doi "https://doi.org/10.1109/mid50463.2021.9361624" @default.
- W3133966072 hasPublicationYear "2021" @default.
- W3133966072 type Work @default.
- W3133966072 sameAs 3133966072 @default.
- W3133966072 citedByCount "5" @default.
- W3133966072 countsByYear W31339660722021 @default.
- W3133966072 countsByYear W31339660722022 @default.
- W3133966072 countsByYear W31339660722023 @default.
- W3133966072 crossrefType "proceedings-article" @default.
- W3133966072 hasAuthorship W3133966072A5003975587 @default.
- W3133966072 hasAuthorship W3133966072A5051313954 @default.
- W3133966072 hasAuthorship W3133966072A5059197069 @default.
- W3133966072 hasAuthorship W3133966072A5062641399 @default.
- W3133966072 hasAuthorship W3133966072A5067684078 @default.
- W3133966072 hasAuthorship W3133966072A5075258651 @default.
- W3133966072 hasConcept C110120631 @default.
- W3133966072 hasConcept C119599485 @default.
- W3133966072 hasConcept C127413603 @default.
- W3133966072 hasConcept C138331895 @default.
- W3133966072 hasConcept C138885662 @default.
- W3133966072 hasConcept C159985019 @default.
- W3133966072 hasConcept C192562407 @default.
- W3133966072 hasConcept C202374169 @default.
- W3133966072 hasConcept C204366326 @default.
- W3133966072 hasConcept C21036866 @default.
- W3133966072 hasConcept C21141959 @default.
- W3133966072 hasConcept C26593445 @default.
- W3133966072 hasConcept C2780566776 @default.
- W3133966072 hasConcept C41895202 @default.
- W3133966072 hasConcept C67558686 @default.
- W3133966072 hasConcept C69567186 @default.
- W3133966072 hasConcept C78519656 @default.
- W3133966072 hasConcept C81060104 @default.
- W3133966072 hasConcept C86072612 @default.
- W3133966072 hasConceptScore W3133966072C110120631 @default.
- W3133966072 hasConceptScore W3133966072C119599485 @default.
- W3133966072 hasConceptScore W3133966072C127413603 @default.
- W3133966072 hasConceptScore W3133966072C138331895 @default.
- W3133966072 hasConceptScore W3133966072C138885662 @default.
- W3133966072 hasConceptScore W3133966072C159985019 @default.
- W3133966072 hasConceptScore W3133966072C192562407 @default.
- W3133966072 hasConceptScore W3133966072C202374169 @default.
- W3133966072 hasConceptScore W3133966072C204366326 @default.
- W3133966072 hasConceptScore W3133966072C21036866 @default.
- W3133966072 hasConceptScore W3133966072C21141959 @default.
- W3133966072 hasConceptScore W3133966072C26593445 @default.
- W3133966072 hasConceptScore W3133966072C2780566776 @default.
- W3133966072 hasConceptScore W3133966072C41895202 @default.
- W3133966072 hasConceptScore W3133966072C67558686 @default.
- W3133966072 hasConceptScore W3133966072C69567186 @default.
- W3133966072 hasConceptScore W3133966072C78519656 @default.
- W3133966072 hasConceptScore W3133966072C81060104 @default.
- W3133966072 hasConceptScore W3133966072C86072612 @default.
- W3133966072 hasLocation W31339660721 @default.
- W3133966072 hasOpenAccess W3133966072 @default.
- W3133966072 hasPrimaryLocation W31339660721 @default.
- W3133966072 hasRelatedWork W1984421630 @default.
- W3133966072 hasRelatedWork W2059572312 @default.
- W3133966072 hasRelatedWork W2244384210 @default.
- W3133966072 hasRelatedWork W2370547119 @default.
- W3133966072 hasRelatedWork W289730165 @default.
- W3133966072 hasRelatedWork W2908913238 @default.
- W3133966072 hasRelatedWork W3000282301 @default.
- W3133966072 hasRelatedWork W3133966072 @default.
- W3133966072 hasRelatedWork W3182446554 @default.
- W3133966072 hasRelatedWork W67955672 @default.
- W3133966072 isParatext "false" @default.
- W3133966072 isRetracted "false" @default.
- W3133966072 magId "3133966072" @default.
- W3133966072 workType "article" @default.