FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W3134101410> ?p ?o ?g. }

• W3134101410 endingPage "271" @default.
• W3134101410 startingPage "239" @default.
• W3134101410 abstract "Scalable manufacturing of high-performance lasers and photonic integrated circuits are critical to meeting growing demand for bandwidth in data centers, high-performance computers, and to support 5G infrastructure. All these markets require the high-volume, low-cost manufacturing that silicon photonics is best poised to provide. The main challenge for high-performance photonic integrated circuits on a silicon platform has historically been the lack of an efficient light source. Since the 1980s, heteroepitaxial GaAs-based lasers operating continuous wave at room temperature have been achievable on Si, but these devices could typically only operate for a few hours or even minutes before failure. Alternatively, InP-based heteroepitaxial lasers showed promising reliability, but extremely low power conversion efficiency and limited manufacturability. Only since the 2010s have lasers on silicon achieved commercially relevant reliability. Through heterogeneous integration via wafer bonding III–V lasers to Si, commercial products with high-performance and excellent reliability have been demonstrated. Looking forward, epitaxial approaches could be more favorable due to the scalability of growth on 300 mm substrates relative to bonding from small III–V wafers, but the reliability issues are more challenging due to high densities of crystalline defects. Quantum dot (QD) lasers have shown a unique robustness against a key class of defects—dislocations—and show promise for future commercial reliability. This chapter highlights the recent developments and unique reliability concerns of heterogeneous and epitaxial integration and what has been done thus far to understand and solve these problems. Several prospective technologies are described in terms of their current status and future promise. Heterogeneous integration via wafer bonding and heteroepitaxial integration of QD lasers are discussed in detail for, respectively, their existing commercial performance and near-term future promise. The chapter concludes with a summary of the current state of reliability of lasers on silicon and recommendations on where the field should focus future efforts to achieve the goal of reliable, low-cost, high-performance photonic integrated circuits on a silicon platform." @default.
• W3134101410 created "2021-03-15" @default.
• W3134101410 creator A5010409452 @default.
• W3134101410 creator A5011906094 @default.
• W3134101410 creator A5024985402 @default.
• W3134101410 creator A5040148310 @default.
• W3134101410 creator A5049709595 @default.
• W3134101410 creator A5071691770 @default.
• W3134101410 creator A5075001016 @default.
• W3134101410 date "2021-01-01" @default.
• W3134101410 modified "2023-09-27" @default.
• W3134101410 title "Reliability of lasers on silicon substrates for silicon photonics" @default.
• W3134101410 cites W1457668193 @default.
• W3134101410 cites W1965366925 @default.
• W3134101410 cites W1971741580 @default.
• W3134101410 cites W1975848432 @default.
• W3134101410 cites W1980679528 @default.
• W3134101410 cites W1984114826 @default.
• W3134101410 cites W1984212175 @default.
• W3134101410 cites W1991853118 @default.
• W3134101410 cites W1992672596 @default.
• W3134101410 cites W1998564819 @default.
• W3134101410 cites W2005722300 @default.
• W3134101410 cites W2029126971 @default.
• W3134101410 cites W2040325478 @default.
• W3134101410 cites W2042007651 @default.
• W3134101410 cites W2050367569 @default.
• W3134101410 cites W2051269089 @default.
• W3134101410 cites W2053285768 @default.
• W3134101410 cites W2054913576 @default.
• W3134101410 cites W2056643700 @default.
• W3134101410 cites W2060045619 @default.
• W3134101410 cites W2070614519 @default.
• W3134101410 cites W2076666666 @default.
• W3134101410 cites W2076872518 @default.
• W3134101410 cites W2077121871 @default.
• W3134101410 cites W2081529790 @default.
• W3134101410 cites W2090326785 @default.
• W3134101410 cites W2165529511 @default.
• W3134101410 cites W2166138619 @default.
• W3134101410 cites W2223732696 @default.
• W3134101410 cites W2296414682 @default.
• W3134101410 cites W2339231754 @default.
• W3134101410 cites W2405149362 @default.
• W3134101410 cites W2571174683 @default.
• W3134101410 cites W2673183782 @default.
• W3134101410 cites W2763635709 @default.
• W3134101410 cites W2770041634 @default.
• W3134101410 cites W2771544890 @default.
• W3134101410 cites W2780040537 @default.
• W3134101410 cites W2794513901 @default.
• W3134101410 cites W2798043424 @default.
• W3134101410 cites W2800788767 @default.
• W3134101410 cites W2805228725 @default.
• W3134101410 cites W2822200351 @default.
• W3134101410 cites W2885228174 @default.
• W3134101410 cites W2886592759 @default.
• W3134101410 cites W2895351970 @default.
• W3134101410 cites W2897294070 @default.
• W3134101410 cites W2908051594 @default.
• W3134101410 cites W2911783539 @default.
• W3134101410 cites W2916091505 @default.
• W3134101410 cites W2933780027 @default.
• W3134101410 cites W2942409206 @default.
• W3134101410 cites W2964198803 @default.
• W3134101410 cites W2973977604 @default.
• W3134101410 cites W2975344067 @default.
• W3134101410 cites W2990742422 @default.
• W3134101410 cites W2998857386 @default.
• W3134101410 cites W3017149243 @default.
• W3134101410 cites W3043791322 @default.
• W3134101410 cites W3099669762 @default.
• W3134101410 doi "https://doi.org/10.1016/b978-0-12-819254-2.00002-3" @default.
• W3134101410 hasPublicationYear "2021" @default.
• W3134101410 type Work @default.
• W3134101410 sameAs 3134101410 @default.
• W3134101410 citedByCount "3" @default.
• W3134101410 countsByYear W31341014102021 @default.
• W3134101410 countsByYear W31341014102023 @default.
• W3134101410 crossrefType "book-chapter" @default.
• W3134101410 hasAuthorship W3134101410A5010409452 @default.
• W3134101410 hasAuthorship W3134101410A5011906094 @default.
• W3134101410 hasAuthorship W3134101410A5024985402 @default.
• W3134101410 hasAuthorship W3134101410A5040148310 @default.
• W3134101410 hasAuthorship W3134101410A5049709595 @default.
• W3134101410 hasAuthorship W3134101410A5071691770 @default.
• W3134101410 hasAuthorship W3134101410A5075001016 @default.
• W3134101410 hasConcept C119423029 @default.
• W3134101410 hasConcept C119599485 @default.
• W3134101410 hasConcept C120665830 @default.
• W3134101410 hasConcept C121332964 @default.
• W3134101410 hasConcept C127413603 @default.
• W3134101410 hasConcept C139159486 @default.
• W3134101410 hasConcept C160671074 @default.
• W3134101410 hasConcept C163258240 @default.
• W3134101410 hasConcept C171250308 @default.
• W3134101410 hasConcept C192562407 @default.
• W3134101410 hasConcept C20788544 @default.

• next