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- W3135732735 abstract "Densely packed high-aspect-ratio (HAR) nanostructures are the core elements of future microelectronics components. Manufacturing these nanostructures for device applications requires multiple fabri..." @default.
- W3135732735 created "2021-03-15" @default.
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- W3135732735 date "2021-03-09" @default.
- W3135732735 modified "2023-10-17" @default.
- W3135732735 title "Deep Learning-Based High Throughput Inspection in 3D Nanofabrication and Defect Reversal in Nanopillar Arrays: Implications for Next Generation Transistors" @default.
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- W3135732735 doi "https://doi.org/10.1021/acsanm.0c03283" @default.
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