Matches in SemOpenAlex for { <https://semopenalex.org/work/W3135990798> ?p ?o ?g. }
- W3135990798 endingPage "1714" @default.
- W3135990798 startingPage "1700" @default.
- W3135990798 abstract "Abstract This paper details an investigation into the microstructure, thermal behaviors and joint strength of Sn-0.7Cu-1.5Bi solder alloy on electroless nickel immersion gold (ENIG) surface finish. Besides conventional techniques, the real-time synchrotron imaging was used to analyze the microstructure evolution in Sn-0.7Cu-1.5Bi/ENIG. This research investigated the growth behavior of the primary (Cu,Ni)6Sn5 intermetallic compounds (IMCs) in the solder joint with the Bi alloying. The elemental distribution analysis showed the Ni diffused from the ENIG surface finish and dissolved into the bulk solder during solidification and that the size of the primary (Cu,Ni)6Sn5 IMCs decreased due to the addition of 1.5 wt% Bi. The average kinetic growth rate of the primary (Cu,Ni)6Sn5 IMCs in Sn-0.7Cu-1.5Bi/ENIG was lower than that of the Sn-0.7Cu/ENIG. The thermal analysis revealed that the pasty range slightly increased and the undercooling degree decreased due to the addition of 1.5 wt% Bi for free-standing solder and soldering on ENIG surface finish. The shear strength of the Sn-0.7Cu-1.5Bi/ENIG was determined using a high-speed bond tester, and it increased by ~12% at bulk solder fracture of ~15% within the solder joint interfacial fracture due to the addition of 1.5 wt% Bi into the Sn-0.7Cu. These occurrences can be attributed to the solid solution strengthening effect at the bulk solder and the formation of finer interfacial (Cu,Ni)6Sn5 IMCs within the solder joints. The results indicated that the microstructural changes, especially the size reduction of IMCs, in Sn-0.7Cu-1.5Bi/ENIG impacted the joint strength." @default.
- W3135990798 created "2021-03-29" @default.
- W3135990798 creator A5010930789 @default.
- W3135990798 creator A5033580462 @default.
- W3135990798 creator A5034916578 @default.
- W3135990798 creator A5040844513 @default.
- W3135990798 creator A5045818454 @default.
- W3135990798 creator A5046400555 @default.
- W3135990798 creator A5060024785 @default.
- W3135990798 date "2021-05-01" @default.
- W3135990798 modified "2023-09-26" @default.
- W3135990798 title "Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG)" @default.
- W3135990798 cites W1972025041 @default.
- W3135990798 cites W1973738553 @default.
- W3135990798 cites W1973991270 @default.
- W3135990798 cites W1974613028 @default.
- W3135990798 cites W1977396262 @default.
- W3135990798 cites W1991949068 @default.
- W3135990798 cites W2002550303 @default.
- W3135990798 cites W2008312767 @default.
- W3135990798 cites W2012883830 @default.
- W3135990798 cites W2015844349 @default.
- W3135990798 cites W2030088338 @default.
- W3135990798 cites W2034455566 @default.
- W3135990798 cites W2034824677 @default.
- W3135990798 cites W2048675378 @default.
- W3135990798 cites W2054186066 @default.
- W3135990798 cites W2055010206 @default.
- W3135990798 cites W2069849028 @default.
- W3135990798 cites W2069889775 @default.
- W3135990798 cites W2089509311 @default.
- W3135990798 cites W2109219420 @default.
- W3135990798 cites W2115456180 @default.
- W3135990798 cites W2129052845 @default.
- W3135990798 cites W2131859423 @default.
- W3135990798 cites W2146320908 @default.
- W3135990798 cites W2192276352 @default.
- W3135990798 cites W2338663925 @default.
- W3135990798 cites W2415670882 @default.
- W3135990798 cites W2542931011 @default.
- W3135990798 cites W2554388705 @default.
- W3135990798 cites W2563111050 @default.
- W3135990798 cites W2571844658 @default.
- W3135990798 cites W2574325203 @default.
- W3135990798 cites W2776104718 @default.
- W3135990798 cites W2789704175 @default.
- W3135990798 cites W2795526717 @default.
- W3135990798 cites W2888209539 @default.
- W3135990798 cites W2889249962 @default.
- W3135990798 cites W2900779754 @default.
- W3135990798 cites W2901131041 @default.
- W3135990798 cites W2920109977 @default.
- W3135990798 cites W2947214880 @default.
- W3135990798 cites W2949126845 @default.
- W3135990798 cites W2966391206 @default.
- W3135990798 cites W2971557977 @default.
- W3135990798 cites W2980606179 @default.
- W3135990798 cites W3007695995 @default.
- W3135990798 cites W3007832998 @default.
- W3135990798 cites W3037675033 @default.
- W3135990798 cites W648698573 @default.
- W3135990798 doi "https://doi.org/10.1016/j.jmrt.2021.03.068" @default.
- W3135990798 hasPublicationYear "2021" @default.
- W3135990798 type Work @default.
- W3135990798 sameAs 3135990798 @default.
- W3135990798 citedByCount "8" @default.
- W3135990798 countsByYear W31359907982021 @default.
- W3135990798 countsByYear W31359907982022 @default.
- W3135990798 countsByYear W31359907982023 @default.
- W3135990798 crossrefType "journal-article" @default.
- W3135990798 hasAuthorship W3135990798A5010930789 @default.
- W3135990798 hasAuthorship W3135990798A5033580462 @default.
- W3135990798 hasAuthorship W3135990798A5034916578 @default.
- W3135990798 hasAuthorship W3135990798A5040844513 @default.
- W3135990798 hasAuthorship W3135990798A5045818454 @default.
- W3135990798 hasAuthorship W3135990798A5046400555 @default.
- W3135990798 hasAuthorship W3135990798A5060024785 @default.
- W3135990798 hasBestOaLocation W31359907981 @default.
- W3135990798 hasConcept C121332964 @default.
- W3135990798 hasConcept C127413603 @default.
- W3135990798 hasConcept C153294291 @default.
- W3135990798 hasConcept C159985019 @default.
- W3135990798 hasConcept C18555067 @default.
- W3135990798 hasConcept C191897082 @default.
- W3135990798 hasConcept C192562407 @default.
- W3135990798 hasConcept C199068039 @default.
- W3135990798 hasConcept C204530211 @default.
- W3135990798 hasConcept C2524010 @default.
- W3135990798 hasConcept C33923547 @default.
- W3135990798 hasConcept C504270822 @default.
- W3135990798 hasConcept C66938386 @default.
- W3135990798 hasConcept C87976508 @default.
- W3135990798 hasConceptScore W3135990798C121332964 @default.
- W3135990798 hasConceptScore W3135990798C127413603 @default.
- W3135990798 hasConceptScore W3135990798C153294291 @default.
- W3135990798 hasConceptScore W3135990798C159985019 @default.
- W3135990798 hasConceptScore W3135990798C18555067 @default.
- W3135990798 hasConceptScore W3135990798C191897082 @default.