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- W3138257647 abstract "The resistance bottleneck in metal-interconnect scaling calls for new interconnect materials. This paper explores topological semimetals as a potential solution. After reviewing the desirable properties of topological semimetals for back-end-of-line (BEOL) interconnects, we use CoSi as an example to demonstrate the decreasing resistance-area product with scaling and provide material-search guidelines." @default.
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- W3138257647 date "2020-12-12" @default.
- W3138257647 modified "2023-09-30" @default.
- W3138257647 title "Topological Semimetals for Scaled Back-End-Of-Line Interconnect Beyond Cu" @default.
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- W3138257647 doi "https://doi.org/10.1109/iedm13553.2020.9371996" @default.
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