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- W3140366148 abstract "RF SiP technology is a technology integrating RF and SiP. RF SiP design technologies include microstrip line, stripline, loop inductance, cross finger capacitor, filter and mixer, which are commonly used in RF circuit design, and bond wire, flip chip, chip stack, cavity, embedded resistor and capacitor, which are commonly used in SiP design. For RF SiP design, the designer needs to find a tool that can support a combination of RF technology and SiP technology; support RF, digital and analog mixed circuits in a uniform environment; and support RF shapes, bond wire, cavity, chip stack, and flip chip. Currently, Mentor Expedition Enterprise (EE) Flow is the only design platform that can support so many technologies in one unified environment. In EE Flow, the designer can realize flexible RF circuit design and simulation. Using the RF Connect interface, RF design data can be exported to Agilent ADS for simulation and verification." @default.
- W3140366148 created "2021-04-13" @default.
- W3140366148 creator A5051096326 @default.
- W3140366148 date "2017-07-14" @default.
- W3140366148 modified "2023-09-27" @default.
- W3140366148 title "RF Circuit Design" @default.
- W3140366148 doi "https://doi.org/10.1002/9781119045991.ch16" @default.
- W3140366148 hasPublicationYear "2017" @default.
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