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- W3143149504 abstract "An accurate thermal analysis is the premise of device optimization,overheating prevention.A calculation method of heating and temperature rise based on the equivalent thermal model of the electromagnetic device is proposed,the result of thermal is compared with that of field-based simulation analysis to verify its correctness.First,the transient thermal model of electromagnetic device is established by ANSYS which contained air-friction loss generated by the move-core of device rotation with shaft in the model,from the result of model analysis,it can be seen that the temperature distribution of the electromagnetic device;then,with analysis of the thermal path,the equivalent thermal model is established,the temperature rises of every part of the electromagnetic device could be figured out by the circuit method;Finally,the results of thermal based on the circuit is compared with the results of the finite element simulation based on the field,the accuracy and feasibility of this equivalent thermal model are verified because the temperature errors are all in the allowable range.The resistivity which changes with temperature rise is considered in thermal analysis based on field and circuit,the coefficients of heat conductivity and convention are also considered as variables of temperature in the thermal analysis." @default.
- W3143149504 created "2021-04-13" @default.
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- W3143149504 date "2012-01-01" @default.
- W3143149504 modified "2023-10-01" @default.
- W3143149504 title "Analysis and Calculation for Heating and Temperature Rise of Magnetic Levitation Device" @default.
- W3143149504 hasPublicationYear "2012" @default.
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