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- W3145192470 abstract "The influence of short circuit events on the power cycling lifetime was investigated. The transfer-molded IGBTs were grouped and then exposed to different number of short circuits, with different energy levels and different initial temperature conditions. After the short circuit treatment, a power cycling test was performed. The lifetime prediction showed no difference of virgin devices compared to devices which were exposed to a low number of short circuits in the range allowed in the datasheet. For devices exposed to higher energy and higher number of short circuits, a decreasing power cycling capability was observed. A supporting thermal simulation was carried out to provide a temperature estimation during the short circuit event." @default.
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- W3145192470 date "2020-07-07" @default.
- W3145192470 modified "2023-09-24" @default.
- W3145192470 title "Influence of repetitive short circuit events on the power cycling capability of IGBTs in a molded package" @default.
- W3145192470 hasPublicationYear "2020" @default.
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