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- W3146504015 abstract "晶片弯曲方法被使用了用 Stoneys 方程在这些电影决定内部压力。在电影免职期间，样品持有者上的晶片固定将限制塑造矩形的晶片的变丑，它可以沿着长度和宽度方向导致压力资料差别。在这份报纸，内部应力由晶片弯曲方法测量了的听电影上的晶片尺寸和晶片固定的效果被讨论。有不同长度 / 宽度比率(L/W=1:1， 2:1， 3:1 和 4:1 ) 的塑造矩形的晶片作为一根伸臂横梁被修理。在听电影免职以后，这电影 / 晶片的侧面用尖笔 profilometer 被测量然后内部压力用在这部电影的 Stoney 方程是计算的。结果证明晶片的固定结束在某种程度上沿着宽度方向限制了晶片的弯曲。为内部应力由晶片弯曲方法测量了的电影，晶片侧面应该沿着长度方向被扫描，扫描距离应该比大或等于晶片长度的一半。当晶片的长度 / 宽度比率到达了 3:1 时，晶片弯曲和计算压力是基本上在沿着长度方向的不同位置的一样。为内部应力由晶片弯曲方法测量了的电影，晶片的长度 / 宽度比率应该被认为比大或等于 3:1，这被推荐，并且使变形的侧面沿着长度方向被扫描。" @default.
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- W3146504015 date "2016-01-01" @default.
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- W3146504015 title "Effect of Wafer Size on the Film Internal Stress Measurement by Wafer Curvature Method" @default.
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