Matches in SemOpenAlex for { <https://semopenalex.org/work/W3148014145> ?p ?o ?g. }
Showing items 1 to 87 of
87
with 100 items per page.
- W3148014145 endingPage "625" @default.
- W3148014145 startingPage "616" @default.
- W3148014145 abstract "The copper-based leadframe is practically proven effective in the thermal and reliability of a Quad Flat No Lead (QFN) three dimension (3D) stacked-die semiconductor package. Reducing the copper thickness is understood to present various thermal and reliability failure mode and mechanisms, such as die cracking and delamination. However, no in-depth study has been pursued in order to determine the capability of achieving the product requirements in terms of thermal and reliability in a 3D stacked-die package. The drive towards a Die-Free Package Cost (DFPC) reduction has led the authors to study the used of a thin leadframe in a QFN 3D stacked-die. Hence, the work presents basis for the qualification of a thin leadframe design and also to demonstrate the thermal and reliability performance. Finally, an extensive virtual thermal-mechanical prototyping has to be achieved in order to understand the physics of materials during the assembly and reliability testing of a 3D stacked-die package with a thin leadframe. This design rule was found to be developed in order to prevent a die crack occurrence between die and leadframe in the semiconductor package." @default.
- W3148014145 created "2021-04-13" @default.
- W3148014145 creator A5029653950 @default.
- W3148014145 date "2009-04-01" @default.
- W3148014145 modified "2023-10-16" @default.
- W3148014145 title "Thermal-Mechanical Analysis of a Different Leadframe Thickness of Semiconductor Package under the Reflow Process" @default.
- W3148014145 doi "https://doi.org/10.3844/ajassp.2009.616.625" @default.
- W3148014145 hasPublicationYear "2009" @default.
- W3148014145 type Work @default.
- W3148014145 sameAs 3148014145 @default.
- W3148014145 citedByCount "3" @default.
- W3148014145 countsByYear W31480141452012 @default.
- W3148014145 countsByYear W31480141452022 @default.
- W3148014145 crossrefType "journal-article" @default.
- W3148014145 hasAuthorship W3148014145A5029653950 @default.
- W3148014145 hasBestOaLocation W31480141451 @default.
- W3148014145 hasConcept C111106434 @default.
- W3148014145 hasConcept C121332964 @default.
- W3148014145 hasConcept C121598971 @default.
- W3148014145 hasConcept C127413603 @default.
- W3148014145 hasConcept C151730666 @default.
- W3148014145 hasConcept C159985019 @default.
- W3148014145 hasConcept C162877825 @default.
- W3148014145 hasConcept C163258240 @default.
- W3148014145 hasConcept C165013422 @default.
- W3148014145 hasConcept C184788189 @default.
- W3148014145 hasConcept C186260285 @default.
- W3148014145 hasConcept C192562407 @default.
- W3148014145 hasConcept C199639397 @default.
- W3148014145 hasConcept C2779227376 @default.
- W3148014145 hasConcept C30239060 @default.
- W3148014145 hasConcept C43214815 @default.
- W3148014145 hasConcept C49040817 @default.
- W3148014145 hasConcept C530198007 @default.
- W3148014145 hasConcept C58097730 @default.
- W3148014145 hasConcept C62520636 @default.
- W3148014145 hasConcept C68928338 @default.
- W3148014145 hasConcept C77928131 @default.
- W3148014145 hasConcept C78519656 @default.
- W3148014145 hasConcept C79635011 @default.
- W3148014145 hasConcept C86803240 @default.
- W3148014145 hasConceptScore W3148014145C111106434 @default.
- W3148014145 hasConceptScore W3148014145C121332964 @default.
- W3148014145 hasConceptScore W3148014145C121598971 @default.
- W3148014145 hasConceptScore W3148014145C127413603 @default.
- W3148014145 hasConceptScore W3148014145C151730666 @default.
- W3148014145 hasConceptScore W3148014145C159985019 @default.
- W3148014145 hasConceptScore W3148014145C162877825 @default.
- W3148014145 hasConceptScore W3148014145C163258240 @default.
- W3148014145 hasConceptScore W3148014145C165013422 @default.
- W3148014145 hasConceptScore W3148014145C184788189 @default.
- W3148014145 hasConceptScore W3148014145C186260285 @default.
- W3148014145 hasConceptScore W3148014145C192562407 @default.
- W3148014145 hasConceptScore W3148014145C199639397 @default.
- W3148014145 hasConceptScore W3148014145C2779227376 @default.
- W3148014145 hasConceptScore W3148014145C30239060 @default.
- W3148014145 hasConceptScore W3148014145C43214815 @default.
- W3148014145 hasConceptScore W3148014145C49040817 @default.
- W3148014145 hasConceptScore W3148014145C530198007 @default.
- W3148014145 hasConceptScore W3148014145C58097730 @default.
- W3148014145 hasConceptScore W3148014145C62520636 @default.
- W3148014145 hasConceptScore W3148014145C68928338 @default.
- W3148014145 hasConceptScore W3148014145C77928131 @default.
- W3148014145 hasConceptScore W3148014145C78519656 @default.
- W3148014145 hasConceptScore W3148014145C79635011 @default.
- W3148014145 hasConceptScore W3148014145C86803240 @default.
- W3148014145 hasIssue "4" @default.
- W3148014145 hasLocation W31480141451 @default.
- W3148014145 hasOpenAccess W3148014145 @default.
- W3148014145 hasPrimaryLocation W31480141451 @default.
- W3148014145 hasRelatedWork W2004297788 @default.
- W3148014145 hasRelatedWork W2063290357 @default.
- W3148014145 hasRelatedWork W2066716746 @default.
- W3148014145 hasRelatedWork W2118477970 @default.
- W3148014145 hasRelatedWork W2121940470 @default.
- W3148014145 hasRelatedWork W2137670425 @default.
- W3148014145 hasRelatedWork W2339567869 @default.
- W3148014145 hasRelatedWork W3148014145 @default.
- W3148014145 hasRelatedWork W4205577782 @default.
- W3148014145 hasRelatedWork W4317382088 @default.
- W3148014145 hasVolume "6" @default.
- W3148014145 isParatext "false" @default.
- W3148014145 isRetracted "false" @default.
- W3148014145 magId "3148014145" @default.
- W3148014145 workType "article" @default.