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• W3149125821 abstract "From an ingot to a wafer then to a die, wafer thinning plays an important role in the semiconductor industry. To reveal the material removal mechanism of semiconductor at nanoscale, molecular dynamics has been widely used to ... | Find, read and cite all the research you need on Tech Science Press" @default.
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• W3149125821 date "2021-01-01" @default.
• W3149125821 modified "2023-09-27" @default.
• W3149125821 title "Local Stress Field in Wafer Thinning Simulations with Phase Space Averaging" @default.
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• W3149125821 doi "https://doi.org/10.32604/cmc.2021.016372" @default.
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