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- W3149463906 abstract "Through-silicon via (TSV) technology is one of the key research directions in the field of microwave and millimeter-wave three-dimensional integrated microsystems. Based on the existing TSV technology, a broadband millimeter-wave coplanar waveguide (CPW) transmission structure is presented in this paper. The transition structure was modeled and optimized. By using the high-diameter-depth-ratio through-hole copper filling process and multilayer bonding process techniques, a sample is fabricated. From the measurement results, the return loss and insertion loss of the symmetrical CPW transmission structure with TSV vias is larger than 20 dB, and smaller than 0.75 dB, respectively." @default.
- W3149463906 created "2021-04-13" @default.
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- W3149463906 date "2020-09-20" @default.
- W3149463906 modified "2023-10-01" @default.
- W3149463906 title "Design and Analysis of Broadband Millimeter Wave Transmission Inter-connection with TSV Technology" @default.
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- W3149463906 doi "https://doi.org/10.1109/icmmt49418.2020.9386914" @default.
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