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• W3150453497 abstract "When highly insulating materials are used as substrates for electronic devices, manufacturing yields become worse, and electronic components are often damaged due to undissipated electrostatic charges on such substrates. In the case of electrospray deposition, the problem of undissipated charges is particularly vexing. If charges accumulated on the substrate are not properly compensated, a repulsive force is generated against the incoming charged droplets, which negatively affects the uniformity and deposition rate of the coating layer. In order to overcome this limitation, we demonstrated a new electrospray method, which can significantly increase the deposition efficiency even in the presence of accumulated charges on nonconductive substrates. A highly reliable superhydrophobic layer was uniformly deposited on highly insulating substrates, including printed circuit board (PCB), polyester (PET), and polyimide (PI) substrates." @default.
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• W3150453497 date "2021-04-07" @default.
• W3150453497 modified "2023-10-06" @default.
• W3150453497 title "High-Efficiency Electrospray Deposition Method for Nonconductive Substrates: Applications of Superhydrophobic Coatings" @default.
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• W3150453497 doi "https://doi.org/10.1021/acsami.0c22867" @default.
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