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- W3150715431 abstract "以便开发铜的一个节省精力的电极淀积过程,在由离子交换膜的铜硫酸盐答案的铜的电极淀积主要房间(IMPC ) 方法被学习了。实验在离子交换膜被执行有在长度,在宽度的 52 公里和在高度的 90 公里的 200 公里的尺寸的主要房间。温度的影响(294 鈥 ? 23 K ) ,在阳极和阴极(1.5 鈥 ?.5 厘米) 之间的间隔, Cu2+ 的集体集中(6 鈥 ? 0 g/L ) , H2SO4 (0 鈥 ? 20 g/L ) 并且 Fe3+(3 鈥?g/L ) 在 catholyte 和答案流动率(0 鈥?cm/s ) 在电流上,密度和当前的效率试验性地被调查。当前的密度随 catholyte 的温度的增加和 Cu2+ 和 H2SO4 的集中增加。阴极当前的效率随温度的增加随 catholyte 和阳极水流效率减少的 Fe3+ 的集中的增加减少。高质量的 cathodic 铜能被获得,膜的当前的密度能比 150 A/m2 和阴极的当前的密度能比 300 A/m2 高的高。实验结果证明那个 IMPC 方法为铜的电极淀积是有效的。" @default.
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- W3150715431 date "2000-01-01" @default.
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- W3150715431 title "Electrodeposition of Copper by IMPC Method" @default.
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