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- W3151500115 abstract "Throughout this chapter, the most common techniques to measure the thermal properties of materials (thermal conductivity and Seebeck effect) will be discussed. For both, we will discuss assemblies considering statistical and dynamic measurements with special emphasis on the specific details of each type of methodology for thin film and bulk samples, always taking particular attention to the quality and resolution of the measurement. Furthermore, the most recent trends in thermal transport measurements will be presented and discussed. Finally, the experimental assemblies will be supported by the physical principles behind the characterization technique of the methodology used." @default.
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- W3151500115 date "2021-01-01" @default.
- W3151500115 modified "2023-10-18" @default.
- W3151500115 title "Thermal and thermoelectrical measurements" @default.
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- W3151500115 doi "https://doi.org/10.1016/b978-0-323-46097-2.00001-x" @default.
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